SUSTAINABLE ENDOTHERMIC HEAT STRIPPING METHOD AND APPARATUS

• US 20100038053A1
• Filed: 08/15/2008
• Published: 02/18/2010
• Est. Priority Date: 08/15/2008
• Status: Active Grant

• Current Assignee: Lighting Science Group Corporation (Pegasus Capital Advisors, L.P.)
• Original Assignee: Lighting Science Group Corporation (Pegasus Capital Advisors, L.P.)
• Inventors: Bastien, Valerie, Henderson, David, Maxik, Fredric S.
• Granted Patent: US 8,631,855 B2
• Time in Patent Office: Days
• US Class Current: 165/80.200
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H01L 23/4275 by melting or evaporation of solids
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes
• CPC Class Codes: H05K 1/0201 Thermal arrangements, e.g. for cooling, heating or preventing overheating
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff

Abstract

A sustainable system for cooling at least one electronic device, for example a Light Emitting Diode (LED), and preferably a plurality of electronic devices, using at least one heat absorbing material contained within a housing that it is in thermal communication with said electronic devices. Said heat absorbing materials may be present individually or in combinations thereof in order to achieve the desired heat absorption effect; said housing may be comprised of multiple chambers containing heat absorbing materials or combinations thereof.

Claims

1. A system for dissipating heat energy comprising:

a. at least one electronic device;

b. at least one housing, wherein said housing is in thermal communication with said electronic device; and

c. at least one heat absorbing material contained within said housing.

2. The system of claim 1, wherein said electronic device is an LED.

3. The system of claim 1, wherein said heat absorbing material is a phase change material.

4. The system of claim 1, wherein said heat absorbing material is an ion crystal forming material.

5. The system of claim 1, wherein said heat absorbing material is selected from the group consisting of an organic paraffin compound, n-octadecane, low-temperature solder alloy, low-temperature metal, neicosane, muriatic acid, stearic acid, acetamide, wax, a eutectic alloy of bismuth, a eutectic alloy of lead, an eutectic alloy of tin, eutectic salt, an alkali metal, a hydrate of the inorganic salts of alkali, a hydrated salt, a eutectic of the chlorides, a nitrate, an acetate, and an ammoniate of the light metals.

6. The system of claim 5, wherein said system comprises two or more heat absorbing materials.

7. The system of claim 1, wherein said at least one heat absorbing material is microencapsulated.

8. The system of claim 1, wherein said housing comprises a first chamber and a second chamber, said first chamber containing a first heat absorbing material and said second chamber containing a second heat absorbing material.

9. The system of claim 8, wherein said first heat absorbing material and said second heat absorbing material are independently selected from the group consisting of an organic paraffin compound, n-octadecane, low-temperature solder alloy, low-temperature metal, neicosane, muriatic acid, stearic acid, acetamide, wax, a eutectic alloy of bismuth, a eutectic alloy of lead, an eutectic alloy of tin, eutectic salt, an alkali metal, a hydrate of the inorganic salts of alkali, a hydrated salt, a eutectic of the chlorides, a nitrate, an acetate, and an ammoniate of the light metals.

10. A system for dissipating heat energy comprising:

a. at least one LED;

b. at least one housing, wherein said housing is in thermal communication with said LED; and

c. at least one heat absorbing material selected from the group consisting of an organic paraffin compound, n-octadecane, low-temperature solder alloy, low-temperature metal, neicosane, muriatic acid, stearic acid, acetamide, wax, a eutectic alloy of bismuth, a eutectic alloy of lead, an eutectic alloy of tin, eutectic salt, an alkali metal, a hydrate of the inorganic salts of alkali, a hydrated salt, a eutectic of the chlorides, a nitrate, an acetate, and an ammoniate of the light metals contained within said housing.

11. The system of claim 10, wherein said system comprises two or more heat absorbing materials.

12. The system of claim 10, wherein said at least one heat absorbing material is micro encapsulated.

13. The system of claim 10, wherein said housing comprises a first chamber and a second chamber, said first chamber containing a first heat absorbing material and said second chamber containing a second heat absorbing material.

14. The system of claim 13, wherein said first heat absorbing material and said second heat absorbing material are independently selected from the group consisting of an organic paraffin compound, n-octadecane, low-temperature solder alloy, low-temperature metal, neicosane, muriatic acid, stearic acid, acetamide, wax, a eutectic alloy of bismuth, a eutectic alloy of lead, an eutectic alloy of tin, eutectic salt, an alkali metal, a hydrate of the inorganic salts of alkali, a hydrated salt, a eutectic of the chlorides, a nitrate, an acetate, and an ammoniate of the light metals.