APPARATUS AND METHOD FOR USE IN MOUNTING ELECTRONIC ELEMENTS

• US 20100052126A1
• Filed: 11/09/2009
• Published: 03/04/2010
• Est. Priority Date: 04/26/2006
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Hong Kong Limited (Wolfspeed, Inc.)
• Inventors: CHEONG, CHENG SIU, HUI, XIE JIAN
• Granted Patent: US 8,362,605 B2
• Time in Patent Office: Days
• US Class Current: 257/676
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

Some embodiments provide surface mount devices that include a first electrode comprising a chip carrier part, a second electrode disposed proximate to the chip carrier part, and a casing encasing a portion of the first and second electrodes. The first electrode can extend from the chip carrier part toward a perimeter of the casing, and the second electrode can extend away from the chip carrier part and projects outside of the casing. In extending away from the chip carrier part the first electrode divides into a plurality of leads separated by an aperture that join into a single first joined lead portion with a first width before projecting outside of the casing and maintains the first width outside of the casing. The second electrode can attain a second width prior to projecting outside of the casing and maintains the second width outside the casing.

Claims

1. A surface mount device, comprising:

a casing comprising a first surface;

a recess formed in said first surface and extending at least partially into said casing; and

a plurality of electrodes at least partially encased by said casing, wherein one of said electrodes comprises a first electrode with a chip carrier part at least partially exposed through said recess;

said first electrode dividing into a first plurality of leads as it extends away from said chip carrier part toward the perimeter of said casing, with said first plurality of leads joining into a single joined lead portion before said first electrode portion projects outside of said casing.

2. The device of claim 1, wherein another of said plurality of electrodes comprises a second electrode proximate said first electrode and separated from said chip carrier part by an insulation gap.

3. The device of claim 2, wherein said second electrode extends away from said chip carrier part, attains a second width prior to projecting outside said casing, and maintains said second width outside said casing.

4. The device of claim 1, wherein said single joined lead portion has a first width before said first electrode projects outside said casing, said first electrode maintaining said first width outside said casing.

5. The device of claim 1, wherein said first plurality of leads are separated by an aperture as said first electrode extends from said chip carrier part to the perimeter of said casing.

6. The device of claim 5, wherein said first electrode is positioned relative to said casing such that said portion of the chip carrier part and a first portion of said aperture are exposed through said recess.

7. The device of claim 6, wherein casing material forming said casing extends through a second portion of said aperture not exposed through said recess.

8. The device of claim 6, further comprising a fill material disposed within at least a portion of said recess such that at least a portion of said fill material extends into said first portion of said aperture.

9. The device of claim 2, wherein said second electrode comprises a second plurality of leads separated by an inlet and is positioned relative to said casing such that a portion of each of said second plurality of leads and a first portion of said inlet are exposed through said recess.

10. The device of claim 9, further comprising a fill material extending into said first portion of said inlet, and casing material extending through a second portion of said inlet not exposed by said recess.

11. The device of claim 1, wherein said first electrode widens as it extends from said chip carrier part toward the perimeter of said casing, narrows as it splits into said first plurality of leads, and widens as said first plurality of leads join into said first joined lead portion before said first electrode projects outside said casing.

12. The device of claim 11, further comprising:

a first indentation along a first edge of said first electrode; and

a second indentation along a second edge of said first electrode, said first and second indentations defined by the widening of said chip carrier part, the narrowing of said plurality of leads, and the widening of said first joined lead portion.

13. The device of claim 2, wherein said second electrode comprises a second plurality of leads, with each of said leads comprising a head end proximate said chip carrier part such that an edge of each said head ends is parallel to the edges of said chip carrier part, and a portion of said chip carrier part extends between said head ends.

14. The device of claim 13, wherein said second plurality of leads join into a second joined lead portion before said second electrode projects outside said casing, with said second electrode widening as said second plurality of leads join into said second joined lead portion.

15. The device of claim 2, wherein said insulation gap between said first electrode and said second electrode is formed by edges of said second electrode paralleling edges of said chip carrier part.

16. The device of claim 2, wherein said first electrode and said second electrode in combination are generally H-shaped.

17. The device of claim 1, further comprising one or more electronic and/or optoelectronic devices coupled with at least one of said plurality of electrodes and at least partially exposed through said recess.

18. A surface mount device, comprising:

a casing comprising a first surface;

a recess formed in said first surface and extending at least partially into said casing; and

a plurality of electrodes at least partially encased by said casing, wherein one of said electrodes comprises a first electrode with a chip carrier part at least partially exposed through said recess;

said first electrode comprising a plurality of leads extending away from said chip carrier part, with a first and second of said leads generally extending in a first direction away from said chip carrier part, and a third lead extending in a second direction away from said chip carrier part.

19. The device of claim 18, wherein another of said plurality of electrodes comprises a second electrode proximate said chip carrier part and separated from said first electrode by an insulation gap.

20. The device of claim 19, wherein said first and second leads are separated by a first lead gap, and said third lead and said second electrode are separated by a second lead gap.

21. The device of claim 20, wherein said first and second electrodes are positioned relative to the casing such that a portion of said chip carrier part, a portion of said isolation gap, a portion of said first lead gap, and a portion of said second lead gap extend are exposed through said recess.

22. The device of claim 18, wherein said chip carrier part further comprises an extension portion and an extension indentation formed in said extension portion, such that a portion of said extension indentation is exposed through said recess.

23. The device of claim 22, further comprising a fill material filling at least a portion of said recess and extending into a portion of said insulation gap, a portion of said first lead gap, a portion of said second lead gap and a portion of said extension indentation that are exposed through said recess.

24. The device of claim 18, further comprising one or more electronic and/or optoelectronic devices coupled with at least one of said plurality of electrodes and at least partially exposed through said recess.

25. A surface mount device, comprising:

a casing comprising a first surface;

a recess formed in said first surface and extending at least partially into said casing; and

a plurality of electrodes at least partially encased by said casing, wherein at least one of said electrodes divides into a plurality of leads;

one or more of said electrodes and said leads comprising one or more gaps between them, with at least a portion of at least one of said gaps exposed through said recess.

26. The device of claim 25, wherein at least one of said electrodes comprises a chip carrier part at least partially exposed through said recess.

27. The device of claim 25, wherein exposing said gaps through said recess optimizes the stability and operability of the surface mount device.

28. The device of claim 25, wherein said gaps not exposed through said recess optimize the stability of the surface mount device by one or more of casing material, fill material, and adhesive material extending through at least portions of the gaps and areas around said electrodes.

29. A surface mount device, comprising:

a casing comprising a recess extending at least partially into said casing; and

a plurality of electrodes at least partially encased by said casing, wherein at least one of said electrodes comprises a portion exposed through said recess, at least one of said electrodes comprising one or more stabilizing features to secure the positioning of said electrodes relative to said casing.

30. The device of claim 29, wherein a portion of at least one of said electrodes not encased by said casing passes over at least two surfaces of said casing.

31. The device of claim 29, wherein said electrodes comprise a thermally conductive material for drawing heat away from an electronic element mounted on at least a portion of one of said electrodes.

32. The device of claim 29, wherein said one or more features comprises one or more apertures.

33. The device of claim 29, wherein said one or more features comprises one or more inlets.

34. The device of claim 29, wherein said one or more features comprises one or more gaps.

35. The device of claim 29, wherein said one or more features comprises one or more indentations.

36. The device of claim 29, wherein said one or more features comprises one or more angled surfaces.

37. The device of claim 29, wherein said one or more features comprises one or more extension portions.

38. The device of claim 29, wherein said one or more features comprises one or more head ends.