Package for Semiconductor Devices
First Claim
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1. An insulated semiconductor packaging device comprising:
- a leadframe comprising a header connected to a mounting bracket;
at least one semiconductor die mounted to the header of the leadframe;
at least two spaced external conductors extending from said header such that the at least two spaced external conductors are not electrically connected to the header of the leadframe, said one of the at least two spaced external conductor is substantially parallel to the other of the at least two spaced external conductors;
at least a first bonding wire being electrically connected between the die and one of the at least two spaced external conductors not electrically connected to the leadframe and at least a second bonding wire being electrically connected between the die and the other of the at least two spaced external conductors not electrically connected to the header of the leadframe so that the die is electrically insulated from the leadframe; and
a housing enclosing said die and said at least first and second bonding wires, said housing providing mechanical support to the at least two spaced external conductors.
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Abstract
A packaged semiconductor device including a semiconductor die mounted on a header of a leadframe. A plurality of spaced external conductors extends from the header and at least one of the external conductors has a bond wire post at one end thereof such that a bonding wire extends between the bond wire post and the semiconductor die. The package device also includes a housing, which encloses the semiconductor die, the header, the bonding wire and the bonding wire post resulting in an insulated packaged device.
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Citations
20 Claims
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1. An insulated semiconductor packaging device comprising:
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a leadframe comprising a header connected to a mounting bracket; at least one semiconductor die mounted to the header of the leadframe; at least two spaced external conductors extending from said header such that the at least two spaced external conductors are not electrically connected to the header of the leadframe, said one of the at least two spaced external conductor is substantially parallel to the other of the at least two spaced external conductors; at least a first bonding wire being electrically connected between the die and one of the at least two spaced external conductors not electrically connected to the leadframe and at least a second bonding wire being electrically connected between the die and the other of the at least two spaced external conductors not electrically connected to the header of the leadframe so that the die is electrically insulated from the leadframe; and a housing enclosing said die and said at least first and second bonding wires, said housing providing mechanical support to the at least two spaced external conductors. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification