THERMOCOUPLE
First Claim
1. A thermocouple for measuring a temperature within a reaction chamber comprising:
- a sheath having a measuring tip and an opening;
a support member having a first distal end and an opposing a second distal end;
a first wire received within said support member;
a second wire received within said support member, said second wire being spaced-apart from said first wire within said support member; and
a spacing member that receives said support member, said spacing member being attached to said sheath, wherein said spacing member allows said support member, said first wire, and said second wire to independently thermally expand and contract.
2 Assignments
0 Petitions
Accused Products
Abstract
A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wires form a junction that contacts the inner surface of the sheath at the measuring tip. A spacing member is secured at the opening of the sheath and receives the support member. The spacing member allows the support member, first wire, and second wire to freely thermally expand relative to each other without introducing compression or tension stresses therein.
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Citations
21 Claims
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1. A thermocouple for measuring a temperature within a reaction chamber comprising:
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a sheath having a measuring tip and an opening; a support member having a first distal end and an opposing a second distal end; a first wire received within said support member; a second wire received within said support member, said second wire being spaced-apart from said first wire within said support member; and a spacing member that receives said support member, said spacing member being attached to said sheath, wherein said spacing member allows said support member, said first wire, and said second wire to independently thermally expand and contract. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A temperature control system for use in a semiconductor processing reactor, said temperature control system comprising:
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at least one heating element located within said reactor; a controller operatively connected to said at least one heating element, said controller configured to control said at least one heating element; and at least one temperature sensor located within said reactor, said at least one temperature sensor operatively connected to said controller for providing temperature data to said controller, wherein said at least one temperature sensor includes a thermocouple, said thermocouple comprises; a sheath having an opening; a support member, a portion of said support member disposed within said sheath; a first wire and a second wire formed of dissimilar metals, a portion of said first and second wires received within said support member; and a spacing member operatively connected to said sheath, wherein said spacing member receives said support member and said first and second wires, and said spacing member allows said support member, said first wire, and said second wire to freely thermally expand at different rates without introducing compression stresses therein. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21)
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Specification