Method of Manufacturing a Semiconductor Device
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Abstract
The present invention supplies a manufacturing method of a semiconductor device, which includes a non-contact inspection process capable of confirming if a circuit or circuit element formed on an array substrate is normally performed and can decrease a manufacturing cost by eliminating wastes to keep a defective product forming.
An electromotive force generated by electromagnetic induction is rectified and shaped by using primary coils formed on a check substrate and secondary coils formed on an array substrate, whereby a power source voltage and a driving signal are supplied to circuits or circuit elements on a TFT substrate so as to be driven.
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Citations
80 Claims
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1-66. -66. (canceled)
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67. A display device comprising:
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a display portion formed over a substrate; and a wireless data receiving unit formed over the substrate, the wireless data receiving unit being configured to receive video signals in a non-contact manner. - View Dependent Claims (68, 69, 70, 71, 72, 73)
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74. A display device comprising:
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a display portion formed over a substrate; a wireless data receiving unit formed over the substrate, the wireless data receiving unit being configured to receive video signals in a non-contact manner; and a wireless power receiving unit formed over the substrate, the wireless power receiving unit being configured to receiving an electromotive force. - View Dependent Claims (75, 76, 77, 78, 79, 80)
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Specification