THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
First Claim
1. A method, comprising:
- providing a first substrate which carries a circuit and interconnect region; and
coupling a second substrate to the interconnect region through a conductive bonding layer, wherein the second substrate includes first and second portions and a detach layer.
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Accused Products
Abstract
A semiconductor circuit structure includes a support substrate which carries an interconnect region and electronic circuitry. The semiconductor circuit structure includes a device substrate coupled to the interconnect region through a conductive bonding layer. The device substrate includes a planarized surface which faces the conductive bonding layer. The device substrate can carry laterally oriented semiconductor devices which are connected to the electronic circuitry carried by the support substrate. The device substrate can be processed to form vertically oriented semiconductor devices which are connected, through the interconnect region and conductive bonding layer, to the electronic circuitry carried by the support substrate.
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Citations
19 Claims
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1. A method, comprising:
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providing a first substrate which carries a circuit and interconnect region; and coupling a second substrate to the interconnect region through a conductive bonding layer, wherein the second substrate includes first and second portions and a detach layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification