SUBSTRATE DIVIDING METHOD
0 Assignments
0 Petitions
Accused Products
Abstract
A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate 1 having a front face 3 formed with functional devices 19 with laser light while positioning a light-converging point within the substrate, so as to form a modified region including a molten processed region due to multiphoton absorption within the semiconductor substrate 1, and causing the modified region including the molten processed region to form a starting point region for cutting; and grinding a rear face 21 of the semiconductor substrate 1 after the step of forming the starting point region for cutting such that the semiconductor substrate 1 attains a predetermined thickness.
191 Citations
12 Claims
-
1-6. -6. (canceled)
-
7. A semiconductor chip manufacturing method wherein a semiconductor substrate having a plurality of functional devices formed like a matrix on its front face is divided into the functional devices to obtain semiconductor chips comprising the steps of:
-
irradiating a substrate with laser light to form a modified region as a starting point within the substrate along a line along which the substrate should be cut which is set like a grid running between the functional devices adjacent to each other; and grinding or etching a rear face of the substrate after forming the modified region such that the substrate attains a predetermined thickness; wherein after forming the modified region and before grinding or etching the rear face of the substrate, fractures generated from the modified region reach a front face of the substrate. - View Dependent Claims (8, 9, 10, 11, 12)
-
Specification