SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
First Claim
1. A method for manufacturing a semiconductor device, comprising:
- forming a lower-layer insulating film on a base plate;
fixing, on the lower-layer insulating film, a plurality of semiconductor constituents each having a semiconductor substrate and a plurality of electrodes for external connection provided under the semiconductor substrate;
forming an insulation layer on the lower-layer insulating film in the periphery of the semiconductor constituents and forming an upper-layer insulating film on the semiconductor constituents and the insulation layer;
removing the base plate;
forming lower-layer wirings connected with the electrodes for external connection of the semiconductor constituent under the lower-layer insulating film and forming upper-layer wirings on the upper-layer insulating film; and
obtaining a plurality of semiconductor devices by cutting the lower-layer insulating film, the insulation layer, and the upper-layer insulating film between the semiconductor constituents.
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Accused Products
Abstract
A semiconductor device includes a semiconductor constituent provided with a semiconductor substrate and a plurality of electrodes for external connection provided under the semiconductor substrate. A lower-layer insulating film is provided under and around the semiconductor constituent. A plurality of lower-layer wirings are electrically connected to the electrodes for external connection of the semiconductor constituent, and provided under the lower-layer insulating film. An insulation layer is provided on the lower-layer insulating film in the periphery of the semiconductor constituent. An upper-layer insulating film is provided on the semiconductor constituent and the Insulation layer. A plurality of upper-layer wirings are provided on the upper-layer insulating film. A base plate on which the semiconductor constituent and the insulation layer are mounted is removed.
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Citations
16 Claims
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1. A method for manufacturing a semiconductor device, comprising:
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forming a lower-layer insulating film on a base plate; fixing, on the lower-layer insulating film, a plurality of semiconductor constituents each having a semiconductor substrate and a plurality of electrodes for external connection provided under the semiconductor substrate; forming an insulation layer on the lower-layer insulating film in the periphery of the semiconductor constituents and forming an upper-layer insulating film on the semiconductor constituents and the insulation layer; removing the base plate; forming lower-layer wirings connected with the electrodes for external connection of the semiconductor constituent under the lower-layer insulating film and forming upper-layer wirings on the upper-layer insulating film; and obtaining a plurality of semiconductor devices by cutting the lower-layer insulating film, the insulation layer, and the upper-layer insulating film between the semiconductor constituents. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method for manufacturing a semiconductor device, comprising:
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forming a lower-layer insulating film on a base plate; fixing, on the lower-layer insulating film, a plurality of semiconductor constituents each having a semiconductor substrate and a plurality of electrodes for external connection provided under the semiconductor substrate; forming a lower-side insulation layer and an upper-side insulation layer on an upper side of the lower-layer insulating film in the peripheries of the semiconductor constituents, providing a circuit substrate having intermediate wirings between the lower-side insulation layer and the upper-side insulation layer, and forming an upper-layer insulating film on the semiconductor constituents and the upper-side insulation layer; removing the base plate from the lower-layer insulating film; forming lower-layer wirings to be connected to electrodes for external connection of the semiconductor constituent and the intermediate wirings of the circuit substrate under the lower-side insulating film, and forming upper-layer wirings to be connected to the intermediate wirings of the circuit substrate on the upper-layer insulating film; and cutting the lower-layer insulating film, the lower-layer insulation layer, the circuit substrate, the upper-layer insulation layer, and the upper-layer insulating film between the semiconductor constituents and obtaining a plurality of semiconductor devices. - View Dependent Claims (16)
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Specification