OPTIMIZATION OF DESICCANT USAGE IN A MEMS PACKAGE
First Claim
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1. A method of encapsulating a MEMS device, the method comprising:
- providing a MEMS package, said MEMS package comprisinga substrate supporting a MEMS device;
a backplate sealed to said substrate to form the MEMS package; and
a desiccant within the MEMS package, the desiccant comprisingcalcium oxide and a polymer binding; and
heating the MEMS package to cause moisture within the package to be chemically absorbed by the calcium oxide.
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Abstract
A MEMS device may be package with a desiccant to provide a moisture-free environment. In order to avoid undesirable effects on the MEMS device, the desiccant may be selected or treated so as to be compatible with a particular MEMS device. This treatment may include baking of the desiccant to as to cause outgassing of moisture or other undesirable material. The structure of the MEMS device may also be altered to improve compatibility with particular desiccants.
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Citations
29 Claims
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1. A method of encapsulating a MEMS device, the method comprising:
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providing a MEMS package, said MEMS package comprising a substrate supporting a MEMS device; a backplate sealed to said substrate to form the MEMS package; and a desiccant within the MEMS package, the desiccant comprising calcium oxide and a polymer binding; and heating the MEMS package to cause moisture within the package to be chemically absorbed by the calcium oxide. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of encapsulating a MEMS device, the method comprising:
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providing a substrate supporting a MEMS device; providing a backplate; providing a desiccant, said desiccant comprising calcium oxide and polytetrafluoroethylene; baking said desiccant under conditions sufficient to cause outgassing of organics retained therein; and sealing said backplate to said substrate to form a MEMS package encapsulating the MEMS device and the desiccant. - View Dependent Claims (8, 9)
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10. A method of encapsulating a MEMS device, the method comprising:
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providing a substrate supporting a MEMS device; providing a backplate; providing a desiccant, said desiccant comprising calcium oxide and a polymer binding; baking said desiccant under conditions sufficient to cause outgassing of solvents retained therein; and sealing said backplate to said substrate to form a MEMS package encapsulating the MEMS device and the desiccant. - View Dependent Claims (11, 12, 13, 14)
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15. A method of encapsulating a MEMS device, comprising:
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providing a substrate supporting a MEMS device, the MEMS device comprising a movable layer, wherein said movable layer comprises aluminum and neodymium; providing a backplate; providing a desiccant; and sealing the backplate to the substrate to form a MEMS package encapsulating the MEMS device and the desiccant.
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16. A MEMS package, said MEMS package comprising:
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a substrate supporting a MEMS device comprising a movable layer, wherein said movable layer comprises aluminum and neodymium; a backplate sealed to said substrate to form a MEMS package encapsulating said MEMS device; and a desiccant sealed within said MEMS package. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 25)
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24. The apparatus of claim 24, wherein the image source module comprises at least one of a receiver, transceiver, and transmitter.
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26. An MEMS device package, comprising:
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means for absorbing moisture; first means for supporting said absorbing means; second means for supporting a MEMS structure, wherein the MEMS structure comprises means for inhibiting the formation of protrusions on a surface of the MEMS structure; and means for sealing said second supporting means to said first supporting means. - View Dependent Claims (27, 28, 29)
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Specification