ORGANIC INVERTER INCLUDING SURFACE-TREATED LAYER AND METHOD OF MANUFACTURING THE SAME
First Claim
1. A method of manufacturing an organic inverter, comprising the steps of:
- forming a driver transistor including a gate electrode, a driver insulating layer and source and drain electrodes on a substrate;
forming a load transistor including a gate electrode, a load insulating layer and source and drain electrodes on the substrate;
surface-treating one of the driver insulating layer and the load insulating layer; and
forming organic semiconductor layers on the load insulating layer or the driver insulating layer that is surface-treated and the driver insulating layer or the load insulating layer that is not surface-treated, respectively.
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Abstract
An organic inverter and a method of manufacturing the same are provided, which regulates threshold voltages depending on positions when an inverter circuit is manufactured on a substrate using an organic semiconductor. To form a depletion load transistor and an enhancement driver transistor at adjacent positions of the same substrate, the surface of the substrate is selectively treated by positions or selectively applied by self-assembly monolayer treatment. Thus, a D-inverter having a combination of a depletion mode and an enhancement mode is more easily realized than a conventional method using a transistor size effect. Also, the D-inverter can be realized even with the same W/L ratio, thereby increasing integration density. That is, the W/L ratio does not need to be increased to manufacture a depletion load transistor, thereby improving integration density.
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Citations
4 Claims
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1. A method of manufacturing an organic inverter, comprising the steps of:
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forming a driver transistor including a gate electrode, a driver insulating layer and source and drain electrodes on a substrate; forming a load transistor including a gate electrode, a load insulating layer and source and drain electrodes on the substrate; surface-treating one of the driver insulating layer and the load insulating layer; and forming organic semiconductor layers on the load insulating layer or the driver insulating layer that is surface-treated and the driver insulating layer or the load insulating layer that is not surface-treated, respectively. - View Dependent Claims (2, 3, 4)
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Specification