WIRELESS IC DEVICE AND METHOD FOR MANUFACTURING SAME

• US 20110127336A1
• Filed: 02/08/2011
• Published: 06/02/2011
• Est. Priority Date: 08/19/2008
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: KATO, Noboru
• Granted Patent: US 8,870,077 B2
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 19/30 the primary active element being centre-fed and substantially straight, e.g. Yagi antenna
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

A wireless IC device which functions as a non-contact RFID system even when the wireless IC device is attached to an article containing metal, water, salt or the like, without hindering reduction in size and thickness, and a method for manufacturing the same are obtained. The wireless IC device includes a wireless IC chip arranged to process a predetermined wireless signal, a feed circuit board on which the wireless IC chip is mounted, a loop-shaped electrode that is coupled to the wireless IC chip via the feed circuit board, and a first electrode plate and a second electrode plate that are coupled to the loop-shaped electrode. The loop-shaped electrode is sandwiched between the first electrode plate and the second electrode plate and is arranged such that the loop surface thereof is perpendicular to or tilted with respect to the first and the second electrode plates. At least the first electrode plate out of the first electrode plate and the second electrode plate is used for transmission and reception of the wireless signal.

Claims

1. A wireless IC device comprising:

a wireless IC arranged to process a predetermined wireless signal;

a loop-shaped electrode coupled to the wireless IC; and

a first electrode plate and a second electrode plate coupled to the loop-shaped electrode;

wherein

the loop-shaped electrode is sandwiched between the first electrode plate and the second electrode plate;

the loop-shaped electrode is arranged such that the loop surface thereof is perpendicular to or tilted with respect to the first electrode plate and the second electrode plate; and

at least the first electrode plate is used for transmission and reception of the wireless signal.

2. The wireless IC device according to claim 1, wherein the loop-shaped electrode and the first electrode plate are electrically coupled to each other, and the loop-shaped electrode and the second electrode plate are electromagnetically coupled to each other.

3. The wireless IC device according to claim 1, wherein a feed circuit board including a feed circuit including a resonance circuit that operates at a predetermined resonant frequency is provided between the wireless IC and the loop-shaped electrode.

4. The wireless IC device according to claim 3, wherein the feed circuit includes inductance elements, and the feed circuit board and the loop-shaped electrode are electromagnetically coupled to each other via the inductance elements.

5. The wireless IC device according to claim 1, wherein the loop-shaped electrode is arranged such that at least a portion thereof is perpendicular to or tilted with respect to the first electrode plate and the second electrode plate.

6. The wireless IC device according to claim 1, wherein at least a portion of a metallic article is used as the second electrode plate.

7. A method for manufacturing a wireless IC device that includes a wireless IC arranged to process a predetermined wireless signal, a loop-shaped electrode coupled to the wireless IC, and a first electrode plate and a second electrode plate coupled to the loop-shaped electrode, wherein the loop-shaped electrode is sandwiched between the first electrode plate and the second electrode plate, the loop-shaped electrode is arranged such that the loop surface thereof is perpendicular to or tilted with respect to the first electrode plate and the second electrode plate, and at least the first electrode plate is used for transmission and reception of the wireless signal, the method comprising the steps of:

patterning the first electrode plate and the loop-shaped electrode on a sheet of a metallic plate; and

bending the loop-shaped electrode so as to be perpendicular to or tilted with respect to the first electrode plate.