COSMETIC CO-REMOVAL OF MATERIAL FOR ELECTRONIC DEVICE SURFACES

• US 20110186325A1
• Filed: 06/04/2010
• Published: 08/04/2011
• Est. Priority Date: 02/02/2010
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Theobald, Matthew, Heley, Richard, Dinh, Richard, Tan, Tang, Stagnaro, Adam, Myers, Scott, Pakula, David
• Granted Patent: US 9,363,905 B2
• Time in Patent Office: Days
• US Class Current: 174/50
• CPC Class Codes: G06F 1/1626 with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
• CPC Class Codes: G06F 1/1656 Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203
• CPC Class Codes: G06F 1/1658 related to the mounting of internal components, e.g. disc drive or any other functional module
• CPC Class Codes: G06F 1/1684 Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
• CPC Class Codes: G06F 1/1698 the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone details of antennas disposed inside a computer H01Q1/2266
• CPC Class Codes: H01Q 1/2258 used with computer equipment
• CPC Class Codes: H01Q 1/241 used in mobile communications, e.g. GSM H01Q1/247, H01Q1/248 take precedence
• CPC Class Codes: H01Q 1/42 Housings not intimately mechanically associated with radiating elements, e.g. radome
• CPC Class Codes: H04M 1/0249 Details of the mechanical connection between the housing parts or relating to the method of assembly
• CPC Class Codes: H04M 1/026 Details of the structure or mounting of specific components
• CPC Class Codes: H04M 1/0274 for an electrical connector module
• CPC Class Codes: H05K 5/02 Details
• CPC Class Codes: H05K 5/0208 Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof
• CPC Class Codes: H05K 5/0247 Electrical details of casings, e.g. terminals, passages for cables or wiring
• CPC Class Codes: H05K 5/03 Covers
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor

Abstract

This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.

Claims

1. A method for constructing an electronic device component having a continuous external surface extending across at least one seam between several elements of the electronic device component, comprising:

providing a first element formed from a first material;

providing a second element formed from a second material;

connecting the first and second elements together with an intermediate element formed from a third material to form the electronic device component, wherein the electronic device component comprises a first seam at an interface between the first element and the intermediate element, and a second seam at an interface between the second element and the intermediate element; and

removing excess material from at least two of the first, second and intermediate elements using a single process to form a continuous surface across at least one of the first seam and the second seam.

2. The method of claim 1, further comprising:

grinding material away from at least two of the first, second and intermediate elements.

3. The method of claim 1, further comprising:

applying a tool to the first, second and intermediate elements to remove excess material across one of the first steam and the second seam.

4. The method of claim 3, further comprising:

applying the tool in a different manner to at least two of the first, second and intermediate elements.

5. The method of claim 3, wherein applying the tool in a different manner further comprises:

selecting different settings for the tool for at least two of the first, second and intermediate elements, wherein the settings correspond to one of the first, second and third materials.

6. The method of claim 1, wherein:

the first, second and third materials comprise at least two of metal and plastic.

7. The method of claim 6, wherein:

the first material and the second material are the same.

8. A method for finishing a surface of an electronic device component constructed by connecting at least two elements, comprising:

identifying an element of a component with which a tool is aligned, wherein the component comprises at least two elements connected at an interface, the at least two elements constructed from at least two different materials;

detecting a material of the identified element;

adjusting settings controlling the operation of the tool based on the detected material; and

operating the tool on the identified element to form a continuous surface across the interface between the at least two elements.

9. The method of claim 8, further comprising:

aligning the tool with another of the at least two elements;

detecting that a material of the other of the at least two elements is different than the material of the identified element; and

adjusting the settings based on the detected material of the other of the at least two elements.

10. The method of claim 8, wherein:

the at least two different materials comprise materials having different manufacturing properties.

11. The method of claim 10, wherein:

the at least two different materials comprise at least one metal and one plastic.

12. The method of claim 10, wherein:

a same tool is applied to each of the at least two different materials.

13. The method of claim 8, wherein:

the tool is operative to remove material from each of the at least two elements in regions of the at least two elements adjacent to the interface.

14. The method of claim 13, wherein:

the tool comprises a grinder.

15. The method of claim 8, wherein operating further comprises:

forming a smooth planar surface across the interface.

16. An electronic device component, comprising:

a first element constructed from a first conductive material;

a second metal element constructed from a second conductive material; and

an intermediate element constructed from an insulating material, wherein;

the intermediate element is connected to the first element at a first interface to form a first continuous surface across the first interface; and

the intermediate element is connected to the second element at a second interface to a form a second continuous surface across the second interface.

17. The electronic device component of claim 16, wherein:

the first and second elements are cold worked.

18. The electronic device component of claim 16, wherein:

the first and second continuous surfaces are smooth.

19. The electronic device component of claim 18, wherein:

the first and second continuous surfaces define a single plane.

20. The electronic device component of claim 16, wherein:

the intermediate element is molded between the first and second elements.