COSMETIC CO-REMOVAL OF MATERIAL FOR ELECTRONIC DEVICE SURFACES
First Claim
1. A method for constructing an electronic device component having a continuous external surface extending across at least one seam between several elements of the electronic device component, comprising:
- providing a first element formed from a first material;
providing a second element formed from a second material;
connecting the first and second elements together with an intermediate element formed from a third material to form the electronic device component, wherein the electronic device component comprises a first seam at an interface between the first element and the intermediate element, and a second seam at an interface between the second element and the intermediate element; and
removing excess material from at least two of the first, second and intermediate elements using a single process to form a continuous surface across at least one of the first seam and the second seam.
1 Assignment
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Accused Products
Abstract
This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.
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Citations
20 Claims
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1. A method for constructing an electronic device component having a continuous external surface extending across at least one seam between several elements of the electronic device component, comprising:
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providing a first element formed from a first material; providing a second element formed from a second material; connecting the first and second elements together with an intermediate element formed from a third material to form the electronic device component, wherein the electronic device component comprises a first seam at an interface between the first element and the intermediate element, and a second seam at an interface between the second element and the intermediate element; and removing excess material from at least two of the first, second and intermediate elements using a single process to form a continuous surface across at least one of the first seam and the second seam. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for finishing a surface of an electronic device component constructed by connecting at least two elements, comprising:
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identifying an element of a component with which a tool is aligned, wherein the component comprises at least two elements connected at an interface, the at least two elements constructed from at least two different materials; detecting a material of the identified element; adjusting settings controlling the operation of the tool based on the detected material; and operating the tool on the identified element to form a continuous surface across the interface between the at least two elements. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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16. An electronic device component, comprising:
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a first element constructed from a first conductive material; a second metal element constructed from a second conductive material; and an intermediate element constructed from an insulating material, wherein; the intermediate element is connected to the first element at a first interface to form a first continuous surface across the first interface; and the intermediate element is connected to the second element at a second interface to a form a second continuous surface across the second interface. - View Dependent Claims (17, 18, 19, 20)
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Specification