THERMOELECTRIC DEVICE
First Claim
Patent Images
1. A thermoelectric device, comprising:
- at least one module having a first carrier layer and a second carrier layer, said first carrier layer and said second carrier layer defining an interspace therebetween;
electrical insulation layers disposed on said first carrier layer and on said second carrier layer toward said interspace; and
a plurality of p and n-doped semiconductor elements, disposed alternately in said interspace between said electrical insulation layers and are alternately electrically connected to one another.
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Accused Products
Abstract
A thermoelectric device contains at least one module having a first carrier layer and a second carrier layer, an interspace disposed between the first carrier layer and the second carrier layer, and an electrical insulation layer disposed on each of the first carrier layer and on the second carrier layer toward the interspace. The thermoelectric device further has a plurality of p and n-doped semiconductor elements, which are arranged alternately in the interspace between the insulation layers and are alternately electrically connected to one another.
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Citations
12 Claims
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1. A thermoelectric device, comprising:
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at least one module having a first carrier layer and a second carrier layer, said first carrier layer and said second carrier layer defining an interspace therebetween; electrical insulation layers disposed on said first carrier layer and on said second carrier layer toward said interspace; and a plurality of p and n-doped semiconductor elements, disposed alternately in said interspace between said electrical insulation layers and are alternately electrically connected to one another. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A motor vehicle, comprising:
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an internal combustion engine; an exhaust gas system; a cooling circuit; and a plurality of thermoelectric devices each containing; a hot side connected to said exhaust gas system; a cold side connected to said cooling circuit; at least one module having a first carrier layer and a second carrier layer, said first carrier layer and said second carrier layer defining an interspace therebetween; electrical insulation layers disposed on said first carrier layer and on said second carrier layer toward said interspace; a plurality of p and n-doped semiconductor elements, disposed alternately in said interspace between said electrical insulation layers and are alternately electrically connected to one another; and said first carrier layer connected to the hot side and said second carrier layer connected to the cold side.
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Specification