IN-SITU MASK ALIGNMENT FOR DEPOSITION TOOLS
First Claim
1. A system for handling masked substrates, comprising:
- a chamber having a pedestal for supporting a substrate, and a chuck for supporting a mask in relation to a substrate; and
an alignment system operable to confirm alignment of the mask and the substrate.
1 Assignment
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Accused Products
Abstract
A system for handling masked substrates comprising a chamber having a pedestal for supporting a substrate, and a chuck for supporting a mask in relation to a substrate. The system may include an alignment system operable to confirm alignment of the mask and the substrate. A method of positioning a mask on a substrate in a chamber comprises supporting the mask with a chuck disposed in the chamber and supporting the substrate with a pedestal disposed in the chamber. The method may further comprise aligning one or more reference points on the mask with one or more reference points on the substrate and positioning the mask on the substrate using at least one of the chuck and the pedestal.
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Citations
20 Claims
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1. A system for handling masked substrates, comprising:
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a chamber having a pedestal for supporting a substrate, and a chuck for supporting a mask in relation to a substrate; and an alignment system operable to confirm alignment of the mask and the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of positioning a mask on a substrate in a chamber, comprising:
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supporting the mask with a chuck disposed in the chamber; supporting the substrate with a pedestal disposed in the chamber; aligning one or more reference points on the mask with one or more reference points on the substrate; and positioning the mask on the substrate using at least one of the chuck and the pedestal. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method of handling a mask and a substrate, comprising:
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positioning the mask on the substrate in a first chamber; processing the substrate while the mask is positioned on the substrate in a second chamber; removing the mask from the substrate after processing the substrate in a third chamber; positioning the mask on a carrier in the third chamber; and cleaning the mask on the carrier in a fourth chamber. - View Dependent Claims (19, 20)
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Specification