Shield for Electronic Circuit
First Claim
Patent Images
1. A shield for an electronic circuit, the shield comprising:
- a substrate; and
a metal structure that is arranged on at least one side of the substrate,wherein the metal structure includes non-contiguous subsections, andwherein the non-contiguous subsections of the metal structure are at least partially capacitively connected to one another.
1 Assignment
0 Petitions
Accused Products
Abstract
A metal structure includes a plurality of non-contiguous subsections on a substrate. The subsections are at least partially capacitively connected to one another. This is achieved by the subsections having overlaps on both sides of the substrate and/or by the subsections being connected to one another by capacitors. The capacitive coupling produced constitutes a short circuit for high frequencies and an open circuit for low frequencies. This results in the frequency-selective surface.
-
Citations
20 Claims
-
1. A shield for an electronic circuit, the shield comprising:
-
a substrate; and a metal structure that is arranged on at least one side of the substrate, wherein the metal structure includes non-contiguous subsections, and wherein the non-contiguous subsections of the metal structure are at least partially capacitively connected to one another. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
-
-
13. An electronic circuit for a magnetic resonance tomography (MRT) system, the electronic circuit comprising:
-
a shield comprising; a substrate; and a metal structure that is arranged on at least one side of the substrate, wherein the metal structure includes non-contiguous subsections, and wherein the non-contiguous subsections of the metal structure are at least partially capacitively connected to one another. - View Dependent Claims (14, 15, 16, 17, 18, 19)
-
-
20. A magnetic resonance tomography (MRT) system comprising:
-
at least one electronic circuit comprising; a shield comprising; a substrate; and a metal structure that is arranged on at least one side of the substrate, wherein the metal structure includes non-contiguous subsections, and wherein the non-contiguous subsections of the metal structure are at least partially capacitively connected to one another.
-
Specification