Shield for Electronic Circuit

• US 20130088233A1
• Filed: 10/05/2012
• Published: 04/11/2013
• Est. Priority Date: 10/06/2011
• Status: Abandoned Application

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Martius, Sebastian, Sewiolo, Benjamin
• Application Number:
  US13/646,484
• Publication Number:
  US 20130088233A1
• Time in Patent Office: Days
• US Class Current: 324/322
• CPC Class Codes: A61B 2562/18 Shielding or protection of sensors from environmental influences, e.g. protection from mechanical damage
• CPC Class Codes: A61B 5/055 involving electronic [EMR] or nuclear [NMR] magnetic resonance, e.g. magnetic resonance imaging
• CPC Class Codes: A61N 1/3718 Monitoring of or protection against external electromagnetic fields or currents
• CPC Class Codes: G01R 33/28 Details of apparatus provided for in groups G01R33/44 - G01R33/64
• CPC Class Codes: G01R 33/422 of the radio frequency field

Abstract

A metal structure includes a plurality of non-contiguous subsections on a substrate. The subsections are at least partially capacitively connected to one another. This is achieved by the subsections having overlaps on both sides of the substrate and/or by the subsections being connected to one another by capacitors. The capacitive coupling produced constitutes a short circuit for high frequencies and an open circuit for low frequencies. This results in the frequency-selective surface.

Claims

1. A shield for an electronic circuit, the shield comprising:

a substrate; and

a metal structure that is arranged on at least one side of the substrate,

wherein the metal structure includes non-contiguous subsections, and

wherein the non-contiguous subsections of the metal structure are at least partially capacitively connected to one another.

2. The shield as claimed in claim 1, wherein the electronic circuit is arranged in a magnetic resonance tomography (MRT) system.

3. The shield as claimed in claim 1, wherein the substrate includes a radio-frequency-suitable substrate, a ceramic, a polymer, a glass fiber structure, a dielectric non-conductive material, or a combination thereof.

4. The shield as claimed in claim 1, wherein the metal structure comprises non-magnetic material.

5. The shield as claimed in claim 1, wherein the metal structure comprises gold, silver, copper or aluminum.

6. The shield as claimed in claim 1, wherein the metal structure is arranged on one side of the substrate, and

wherein the non-contiguous subsections of the metal structure are connected to one another via components.

7. The shield as claimed in claim 6, wherein the components comprise capacitors, capacitance diodes, or the capacitors and the capacitance diodes.

8. The shield as claimed in claim 1, wherein the metal structure is arranged on both sides of the substrate, and

wherein the non-contiguous subsections of the metal structure are connected to one another by way of components.

9. The shield as claimed in claim 8, wherein the components comprise capacitors, capacitance diodes, or the capacitors and the capacitance diodes.

10. The shield as claimed in claim 1, wherein the metal structure is arranged on both sides of the substrate such that the non-contiguous subsections arranged on both sides of the substrate partially overlap, thereby resulting in a capacitive coupling by the substrate in an area of the overlap.

11. The shield as claimed in claim 1, wherein the metal structure is connected to a ground of the electronic circuit that is to be shielded.

12. The shield as claimed in claim 1, wherein the shield is arranged such that the shield at least partially hides or shields the electronic circuit.

13. An electronic circuit for a magnetic resonance tomography (MRT) system, the electronic circuit comprising:

a shield comprising;

a substrate; and

a metal structure that is arranged on at least one side of the substrate,

wherein the metal structure includes non-contiguous subsections, and

wherein the non-contiguous subsections of the metal structure are at least partially capacitively connected to one another.

14. The electronic circuit as claimed in claim 13, wherein the electronic circuit is arranged in the magnetic resonance tomography (MRT) system.

15. The electronic circuit as claimed in claim 13, wherein the substrate includes a radio-frequency-suitable substrate, a ceramic, a polymer, a glass fiber structure, a dielectric non-conductive material, or a combination thereof.

16. The electronic circuit as claimed in claim 13, wherein the metal structure comprises non-magnetic material.

17. The electronic circuit as claimed in claim 13, wherein the metal structure comprises gold, silver, copper or aluminum.

18. The electronic circuit as claimed in claim 13, wherein the metal structure is arranged on one side of the substrate, and

wherein the non-contiguous subsections of the metal structure are connected to one another via components.

19. The electronic circuit as claimed in claim 18, wherein the components comprise capacitors, capacitance diodes, or the capacitors and the capacitance diodes.

20. A magnetic resonance tomography (MRT) system comprising:

at least one electronic circuit comprising;

a shield comprising;

a substrate; and

a metal structure that is arranged on at least one side of the substrate,

wherein the metal structure includes non-contiguous subsections, and

wherein the non-contiguous subsections of the metal structure are at least partially capacitively connected to one another.