Laser Diode Assembly
First Claim
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1. A laser diode assembly, comprising:
- a housing having a housing part and a mounting part that is connected to the housing part and that extends away from the housing part along an extension direction, wherein the housing part and the mounting part have a main body composed of copper and wherein the housing part is steel coated;
a laser diode chip disposed on the mounting part, the laser diode chip having a semiconductor layers on a substrate, the semiconductor layers including an active layer for emitting light; and
a first solder layer arranged between the laser diode chip and the mounting part, the first solder layer having a thickness of greater than or equal to 3 μ
m.
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Abstract
A laser diode assembly includes a housing having a housing part and a mounting part that is connected to the housing part and that extends away from the housing part along an extension direction. A laser diode chip is disposed on the mounting part. The laser diode chip has, on a substrate, semiconductor layers with an active layer for emitting light. The housing part and the mounting part have a main body composed of copper and at least the housing part is steel-sheathed. A first solder layer having a thickness of greater than or equal to 3 μm is arranged between the laser diode chip and the mounting part.
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Citations
16 Claims
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1. A laser diode assembly, comprising:
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a housing having a housing part and a mounting part that is connected to the housing part and that extends away from the housing part along an extension direction, wherein the housing part and the mounting part have a main body composed of copper and wherein the housing part is steel coated; a laser diode chip disposed on the mounting part, the laser diode chip having a semiconductor layers on a substrate, the semiconductor layers including an active layer for emitting light; and a first solder layer arranged between the laser diode chip and the mounting part, the first solder layer having a thickness of greater than or equal to 3 μ
m. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification