LIGHT EMITTER COMPONENTS, SYSTEMS, AND RELATED METHODS

• US 20140268728A1
• Filed: 03/15/2013
• Published: 09/18/2014
• Est. Priority Date: 03/15/2013
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Hussell, Christopher P., Joo, Sung Chul, Welch, Erin, Andrews, Peter Scott, Clark, Joseph G., Edmond, John A., Reiherzer, Jesse C.
• Granted Patent: US 9,897,267 B2
• Time in Patent Office: Days
• US Class Current: 362/225
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

Light emitter components, systems, and related methods having improved optical efficiency and a lower manufacturing cost are disclosed. In one aspect, a light emitter component can include a substrate having an elongated body and first and second ends. At least a first trace and a second trace can be provided on the substrate. In some aspects, the first trace can be disposed proximate the first end of the substrate and the second trace can be disposed proximate the second end of the substrate, with no other portion of the first trace or second trace being disposed between the first and second ends of the substrate. In some aspects, a string of LED chips can be provided on the substrate. The string of LED chips can be disposed between the first and second ends of the substrate. Angled traces, gaps and light emitter components can also be provided in some aspects.

Claims

1. A light emitter component, comprising:

a substrate having an elongated body and first and second ends;

at least a first trace and a second trace provided on the substrate, the first trace being disposed proximate the first end of the substrate and the second trace being disposed proximate the second end of the substrate with no other portion of the first trace or second trace being disposed between the first and second ends of the substrate; and

a string of LED chips provided on the substrate, wherein the string of LED chips is disposed between the first and second ends of the substrate.

2. The component of claim 1, wherein a majority of the LED chips are spaced apart from the first trace by approximately 2 millimeters (mm) or more.

3. The component of claim 1, wherein the first trace and the second trace are provided only at the outermost opposing ends of the elongated body.

4. The component of claim 1, wherein the first trace is configured to overlap a portion of a first adjacent substrate.

5. The component of claim 4, wherein the second trace is configured to overlap a portion of a second adjacent substrate.

6. The component of claim 1, wherein the first and second traces comprise a flexible material.

7. The component of claim 1, wherein the first and second traces comprise an adhesive layer.

8. The component of claim 1, wherein the substrate comprises a ceramic material.

9. The component of claim 1, wherein the substrate comprises a length of approximately 20 mm or more.

10. The component of claim 1, wherein the substrate comprises a length of approximately 80 mm or more.

11. The component of claim 1, wherein the string of LED chips is serially connected between the first and the second trace.

12. The component of claim 1, wherein the string of LED chips comprises 10 or more LED chips.

13. The component of claim 1, wherein the string of LED chips comprises 20 or more LED chips.

14. The component of claim 1, wherein a bus wire extends along a portion of the elongated substrate.

15. The component of claim 14, wherein the bus wire is disposed on a back side of the substrate which opposes the string of LED chips.

16. The component of claim 1, wherein a separate conductive foil area is disposed over the substrate and extends between portions of the first and second trace.

17. The component of claim 1, further comprising at least one insulation displacement connector (IDC) disposed on the substrate.

18. The component of claim 17, wherein a first IDC connector is disposed over the first trace and a second IDC connector is disposed over the second trace.

19. The component of claim 17, wherein the IDC connector is disposed on a back side of the substrate which opposes the string of LED chips.

20. The component of claim 1, wherein the first trace and the second trace each comprise a first attachment portion, a second attachment portion, and an intervening attachment portion disposed therebetween.

21. The component of claim 1, wherein each of the first trace and the second trace comprise a length that is less than approximately one half of an overall length of the substrate.

22. The component of claim 1, wherein each of the first trace and the second trace comprise a length that is less than approximately one quarter of an overall length of the board.

23. A light emitter component comprising:

a substrate;

a first trace and a second trace provided on the substrate; and

a string of LED chips provided on the substrate; and

wherein a majority of the LED chips are spaced apart from the first trace by approximately 2 millimeters (mm) or more.

24. The component of claim 23, wherein a majority of the LED chips are spaced apart from the first trace by approximately 5 millimeters (mm) or more.

25. The component of claim 23, wherein the substrate comprises an elongated body.

26. The component of claim 25, wherein the first trace and the second trace are provided at outermost opposing ends of the elongated body.

27. The component of claim 23, wherein the substrate comprises a ceramic material.

28. The component of claim 23, wherein the substrate comprises a length of approximately 80 mm or more.

29. The component of claim 23, wherein the string of LED chips is serially connected between the first and the second trace.

30. The component of claim 23, wherein the string of LED chips comprises 20 or more LED chips.

31. The component of claim 23, wherein a bus wire extends along a portion of the elongated substrate.

32. The component of claim 31, wherein the bus wire is disposed on a back side of the substrate which opposes the string of LED chips.

33. The component of claim 23, wherein a separate conductive foil area is disposed over the substrate and extends between portions of the first and second trace.

34. The component of claim 23, further comprising at least one insulation displacement connector (IDC) disposed on the substrate.

35. The component of claim 34, wherein a first IDC connector is disposed over the first trace and a second IDC connector is disposed over the second trace.

36. The component of claim 34, wherein the IDC connector is disposed on a back side of the substrate which opposes the string of LED chips.

37. The component of claim 23, wherein the first and second traces comprise a flexible tape.

38. The component of claim 23, wherein the first and second traces comprise an adhesive overlay.

39. A system of light emitter components, the system comprising:

a plurality of substrates, each substrate comprising;

an elongated body;

a first trace and a second trace provided proximate outermost opposing ends of the elongated body; and

a plurality of strings of LED chips, wherein each string of the plurality of strings is disposed between one first trace and one second trace provided on the plurality of substrates.

40. The system of claim 39, wherein a majority of the LED chips within each string of the plurality of strings of LED chips are spaced apart from any one first trace by approximately 2 millimeters (mm) or more.

41. The system of claim 39, wherein a majority of the LED chips within each string of the plurality of strings are spaced apart from any one first by approximately 5 millimeters (mm) or more.

42. The system of claim 39, wherein the plurality of substrates is connected using a plurality of bus wires.

43. The system of claim 39, wherein at least one of the first traces provided on at least one substrate of the plurality of substrates overlaps a portion of the at least one substrate and a second substrate.

44. The system of claim 39, further comprising a bus wire extending along a portion of at least one substrate of the plurality of substrates.

45. The system of claim 44, wherein the bus wire is disposed on a back side of the at least one substrate which opposes at least one string of LED chips.

46. The system of claim 39, wherein a separate conductive foil is disposed over each of the plurality of substrates and extends between portions of each of the first and second traces.

47. The system of claim 39, further comprising at least one insulation displacement connector (IDC) disposed on each of the plurality of substrates.

48. The system of claim 47, wherein each substrate further comprises a first IDC connector disposed over the first trace and a second IDC connector disposed over the second trace.

49. The system of claim 47, wherein the IDC connector is disposed on a back side of each substrate of the plurality of substrates, wherein the back side opposes a front side upon which the plurality of strings of LED chips are mounted.

50. A light bulb comprising the system of claim 39.

58. The method of claim 48, further comprising providing an insulation displacement connector (IDC) over backside of the substrate on a surface opposing the string of LED chips.

51. A method of providing a light emitter component, the method comprising:

providing an elongated substrate having a first end and a second end;

providing a first trace and a second trace on the substrate, the first trace being disposed proximate the first end of the substrate and the second trace being disposed proximate the second end of the substrate with no other portion of the first trace or second trace being disposed between the first and second ends of the substrate; and

providing a string of LED chips on the substrate, wherein the string of LED chips is disposed between the first and second ends of the substrate.

52. The method of claim 51, wherein providing the first trace comprises providing a first trace that overlaps a portion of the elongated substrate.

53. The method of claim 51, wherein providing the first trace comprises applying adhesive layer of the first trace over a portion of the elongated substrate.

54. The method of claim 51, wherein providing the elongated substrate comprises providing a ceramic substrate.

55. The method of claim 51, wherein providing the string of LED chips comprises providing a majority of LED chips that spaced apart from the first trace by approximately 2 millimeters (mm) or more.

56. The method of claim 51, further comprising providing a bus wire along a portion of the substrate.

57. The method of claim 51, further comprising providing an insulation displacement connector (IDC) over a portion of at least one of the first and second traces.

59. A light emitter component comprising:

a substrate having a longitudinal axis; and

one or more light emitting diode (LED) devices disposed on the substrate, wherein the one or more LED devices are angled with respect to the longitudinal axis of the substrate.

60. The component of claim 59, wherein the substrate comprises angled traces.

61. The component of claim 59, wherein a reflective material is disposed over the substrate.

62. The component of claim 59, wherein the LED devices comprises an LED package.

63. The component of claim 62, wherein the LED package comprises a substantially hemispheric lens.

64. The component of claim 62, wherein the LED package comprises a substantially cubic lens.

65. The component of claim 60, wherein angled gaps are disposed between portions of the angled traces.

66. The component of claim 59, wherein the component is devoid of a legend or other markings.

67. The component of claim 59, wherein the component comprises one or more LED devices that are non-angled with respect to the longitudinal axis of the substrate.

68. The component of claim 59, wherein the substrate comprises more than 20 LED devices.

69. The component of claim 59, wherein the substrate has a length of 100 millimeters or more.

70. The component of claim 59, wherein the substrate has a length of 100 millimeters or more.