MINIMIZING PLATING STUB REFLECTIONS IN A CHIP PACKAGE USING CAPACITANCE
First Claim
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1. A method, comprising:
- capacitively coupling a plating stub to ground so that the resonant frequency caused by the plating stub in a semiconductor package is shifted away from an operational frequency.
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Abstract
The present invention is directed to shifting the resonant frequency in a high-frequency chip package away from an operational frequency by connecting a capacitance between an open-ended plating stub and ground. One embodiment provides a method including capacitively coupling a plating stub to ground so that the resonant frequency caused by the plating stub in a semiconductor package is shifted away from an operational frequency.
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5 Claims
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1. A method, comprising:
capacitively coupling a plating stub to ground so that the resonant frequency caused by the plating stub in a semiconductor package is shifted away from an operational frequency. - View Dependent Claims (2, 3, 4, 5)
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