METHOD AND DEVICE FOR BONDING OF SUBSTRATES
First Claim
1. A device for bonding of first substrates to second substrates with the following features:
- a receptacle for accommodating at least one carrier substrate,a placement device for placing multiple first substrates on a substrate side of the carrier substrate that faces away from the receptacle, anda fixing device for fixing each of the first substrates on the substrate side on at least one fixing section of each first substrate,wherein the placement device respectively places one or more second substrates on one or more first substrates and the fixing device fixes each of the one or more second substrates respectively placed on the one or more first substrates.
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Accused Products
Abstract
A device and method for bonding first substrates to second substrates. The device includes: a receptacle for accommodating a carrier substrate, a placement device for placing multiple first substrates on a substrate side of the carrier substrate that faces away from the receptacle, and a fixing device for fixing each of the first substrates on the substrate side on at least one fixing section of each first substrate. The method includes the following steps: placement of multiple first substrates on a substrate side of a carrier substrate accommodated on a receptacle, and fixing of each first substrate on the substrate side on at least one fixing section of each first substrate.
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Citations
16 Claims
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1. A device for bonding of first substrates to second substrates with the following features:
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a receptacle for accommodating at least one carrier substrate, a placement device for placing multiple first substrates on a substrate side of the carrier substrate that faces away from the receptacle, and a fixing device for fixing each of the first substrates on the substrate side on at least one fixing section of each first substrate, wherein the placement device respectively places one or more second substrates on one or more first substrates and the fixing device fixes each of the one or more second substrates respectively placed on the one or more first substrates. - View Dependent Claims (2, 3, 4, 5, 6, 12, 13)
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7. A method for simultaneous bonding of first substrates to second substrates, said method comprising:
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placing multiple first substrates on a substrate side of a carrier substrate that is accommodated on a receptacle; fixing of each of the first substrates on the substrate side on at least one fixing section of every first substrate; and placing and fixing the second substrates on the first substrates. - View Dependent Claims (8, 9, 10, 11, 14, 15, 16)
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Specification