METHOD AND DEVICE FOR BONDING OF SUBSTRATES

• US 20140360666A1
• Filed: 12/28/2011
• Published: 12/11/2014
• Est. Priority Date: 12/28/2011
• Status: Abandoned Application

• Current Assignee: EV Group E Thallner GmbH (Thallner Privatstiftung)
• Original Assignee: EV Group E Thallner GmbH (Thallner Privatstiftung)
• Inventors: Burggraf, Jrgen
• Application Number:
  US14/368,827
• Publication Number:
  US 20140360666A1
• Time in Patent Office: Days
• US Class Current: 156/299
• CPC Class Codes: B32B 37/187 the layers being placed in a carrier before going through the lamination process
• CPC Class Codes: B32B 38/18 Handling of layers or the laminate
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/68 for positioning, orientation or alignment
• CPC Class Codes: H01L 21/68771 characterised by supporting more than one semiconductor substrate
• CPC Class Codes: Y10T 156/1092 All laminae planar and face to face
• CPC Class Codes: Y10T 156/1744 Means bringing discrete articles into assembled relationship

Abstract

A device and method for bonding first substrates to second substrates. The device includes: a receptacle for accommodating a carrier substrate, a placement device for placing multiple first substrates on a substrate side of the carrier substrate that faces away from the receptacle, and a fixing device for fixing each of the first substrates on the substrate side on at least one fixing section of each first substrate. The method includes the following steps: placement of multiple first substrates on a substrate side of a carrier substrate accommodated on a receptacle, and fixing of each first substrate on the substrate side on at least one fixing section of each first substrate.

Claims

1. A device for bonding of first substrates to second substrates with the following features:

a receptacle for accommodating at least one carrier substrate,

a placement device for placing multiple first substrates on a substrate side of the carrier substrate that faces away from the receptacle, and

a fixing device for fixing each of the first substrates on the substrate side on at least one fixing section of each first substrate,

wherein the placement device respectively places one or more second substrates on one or more first substrates and the fixing device fixes each of the one or more second substrates respectively placed on the one or more first substrates.

2. The device according to claim 1, wherein the fixing device is set up for temporarily fixing each of the first substrates.

3. The device according to claim 1, wherein the placement device aligns and places the first substrates on alignment marks.

4. The device according to claim 1, wherein the placement device places multiple second substrates on each of the one or more first substrates, said multiple second substrates aligned on alignment marks of the one or more first substrates when placed thereon.

5. The device according to claim 4, wherein the fixing device temporarily fixes each second substrate placed on the one or more first substrates.

6. The device according to claim 4, wherein the device further comprises a bonding chamber, for simultaneous bonding of the first and second substrates.

12. The device according to claim 6, wherein the bonding chamber is provided as a separate bonding module.

13. The device according to claim 6, wherein the first and second substrates are permanently bonded.

7. A method for simultaneous bonding of first substrates to second substrates, said method comprising:

placing multiple first substrates on a substrate side of a carrier substrate that is accommodated on a receptacle;

fixing of each of the first substrates on the substrate side on at least one fixing section of every first substrate; and

placing and fixing the second substrates on the first substrates.

8. A method according to claim 7, wherein the multiple first substrates are temporarily fixed on the substrate side.

9. The method according to claim 7, wherein the multiple first substrates are aligned on alignment marks before placing the multiple first substrates on the substrate side of the carrier substrate that faces away from the receptacle.

10. The method according to claim 7, wherein the second substrates are placed and/or temporarily fixed on the first substrates.

11. The method according to claim 10, wherein the second substrates are in each case simultaneously bonded to the first substrates.

14. The method according to claim 10, wherein the second substrates are placed and/or temporarily fixed on the first substrates after being aligned on alignment marks of the first substrates.

15. The method according to claim 11, wherein the second substrates are permanently bonded to the first substrates.

16. The method according to claim 11, wherein the second substrates are in each case simultaneously bonded to the first substrates in a bonding chamber designed as a separate bonding module.