INDUCTOR EMBEDDED IN A PACKAGE SUBTRATE
First Claim
1. A package substrate comprising:
- a core layer comprising a first surface and a second surface;
a first via located in the core layer;
a first dielectric layer coupled to the first surface of the core layer; and
a first inductor located in the first dielectric layer, the first inductor coupled to the first via in the core layer, wherein the first inductor is configured to generate a magnetic field that laterally traverses the package substrate.
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Abstract
Some novel features pertain to a package substrate that includes a core layer, a first via, a first dielectric layer, and a first inductor. The core layer includes a first surface and a second surface. The first via is located in the core layer. The first dielectric layer is coupled to the first surface of the core layer. The first inductor is located in the first dielectric layer. The first inductor is coupled to the first via in the core layer. The first inductor is configured to generate a magnetic field that laterally traverses the package substrate. In some implementations, the package substrate further includes a first pad coupled to the first inductor, wherein the first pad is configured to couple to a solder ball. In some implementations, the package substrate includes a second via located in the core layer, and a second inductor located in the first dielectric layer.
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Citations
30 Claims
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1. A package substrate comprising:
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a core layer comprising a first surface and a second surface; a first via located in the core layer; a first dielectric layer coupled to the first surface of the core layer; and a first inductor located in the first dielectric layer, the first inductor coupled to the first via in the core layer, wherein the first inductor is configured to generate a magnetic field that laterally traverses the package substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An apparatus comprising:
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a core layer comprising a first surface and a second surface; a first via located in the core layer; a first dielectric layer coupled to the first surface of the core layer; and a first inductor means located in the first dielectric layer, the first inductor means coupled to the first via in the core layer, wherein the first inductor means is configured to generate a magnetic field that laterally traverses the package substrate. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method for fabricating a package substrate, comprising:
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forming a core layer comprising a first surface and a second surface; forming a first via in the core layer; forming a first dielectric layer coupled to the first surface of the core layer; and forming a first inductor in the first dielectric layer such that the first inductor is coupled to the first via in the core layer, wherein the first inductor is configured to generate a magnetic field that laterally traverses the package substrate. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30)
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Specification