INDUCTOR EMBEDDED IN A PACKAGE SUBTRATE

• US 20150279545A1
• Filed: 03/28/2014
• Published: 10/01/2015
• Est. Priority Date: 03/28/2014
• Status: Active Grant

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Qualcomm, Inc.
• Inventors: Fazelpour, Siamak, Paynter, Charles David, Lane, Ryan David
• Granted Patent: US 10,008,316 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2017/002 Details of via holes for interconnecting the layers
• CPC Class Codes: H01F 2017/0066 with a magnetic layer
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

Some novel features pertain to a package substrate that includes a core layer, a first via, a first dielectric layer, and a first inductor. The core layer includes a first surface and a second surface. The first via is located in the core layer. The first dielectric layer is coupled to the first surface of the core layer. The first inductor is located in the first dielectric layer. The first inductor is coupled to the first via in the core layer. The first inductor is configured to generate a magnetic field that laterally traverses the package substrate. In some implementations, the package substrate further includes a first pad coupled to the first inductor, wherein the first pad is configured to couple to a solder ball. In some implementations, the package substrate includes a second via located in the core layer, and a second inductor located in the first dielectric layer.

Claims

1. A package substrate comprising:

a core layer comprising a first surface and a second surface;

a first via located in the core layer;

a first dielectric layer coupled to the first surface of the core layer; and

a first inductor located in the first dielectric layer, the first inductor coupled to the first via in the core layer, wherein the first inductor is configured to generate a magnetic field that laterally traverses the package substrate.

2. The package substrate of claim 1, further comprising a first pad coupled to the first inductor, wherein the first pad is configured to couple to a solder ball.

3. The package substrate of claim 2, wherein the first inductor is configured to provide an impedance difference between the first pad and a signal interconnect of 2.5 ohms or less.

4. The package substrate of claim 1, wherein the first inductor comprises:

a first set of vias; and

a first set of interconnects.

5. The package substrate of claim 1, further comprising:

a second via located in the core layer; and

a second inductor in the first dielectric layer, the second inductor coupled to the second via in the core layer.

6. The package substrate of claim 5, wherein the first inductor is positioned in the first dielectric layer such that the magnetic field that is generated by the first inductor affects the impedance of a pad coupled to the second inductor.

7. The package substrate of claim 5, wherein the first inductor is positioned in the first dielectric layer such that the magnetic field that is generated by the first inductor amplifies a magnetic field that is generated by the second inductor.

8. The package substrate of claim 5, wherein the second inductor is configured to generate a magnetic field that laterally traverses the package substrate.

9. The package substrate of claim 1, further comprising:

a second dielectric layer coupled to the second surface of the core layer; and

a set of interconnects in the second dielectric layer, the set of interconnects coupled to the via in the core layer.

10. The package substrate of claim 1, wherein the package substrate is incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, and/or a laptop computer.

11. An apparatus comprising:

a core layer comprising a first surface and a second surface;

a first via located in the core layer;

a first dielectric layer coupled to the first surface of the core layer; and

a first inductor means located in the first dielectric layer, the first inductor means coupled to the first via in the core layer, wherein the first inductor means is configured to generate a magnetic field that laterally traverses the package substrate.

12. The apparatus of claim 11, further comprising a first pad coupled to the first inductor means, wherein the first pad is configured to couple to a solder ball.

13. The apparatus of claim 12, wherein the first inductor means is configured to provide an impedance difference between the first pad and a signal interconnect of 2.5 ohms or less.

14. The apparatus of claim 11, wherein the first inductor means comprises:

a first set of vertical interconnect means; and

a first set of lateral interconnects means.

15. The apparatus of claim 11, further comprising:

a second via located in the core layer; and

a second inductor means in the first dielectric layer, the second inductor means coupled to the second via in the core layer.

16. The apparatus of claim 15, wherein the first inductor means is positioned in the first dielectric layer such that the magnetic field that is generated by the first inductor means affects the impedance of a pad coupled to the second inductor means.

17. The apparatus of claim 15, wherein the first inductor means is positioned in the first dielectric layer such that the magnetic field that is generated by the first inductor means amplifies a magnetic field that is generated by the second inductor means.

18. The apparatus of claim 15, wherein the second inductor means is configured to generate a magnetic field that laterally traverses the package substrate.

19. The apparatus of claim 11, further comprising:

a second dielectric layer coupled to the second surface of the core layer; and

a set of interconnects in the second dielectric layer, the set of interconnects coupled to the via in the core layer.

20. The apparatus of claim 11, wherein the apparatus is incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, and/or a laptop computer.

21. A method for fabricating a package substrate, comprising:

forming a core layer comprising a first surface and a second surface;

forming a first via in the core layer;

forming a first dielectric layer coupled to the first surface of the core layer; and

forming a first inductor in the first dielectric layer such that the first inductor is coupled to the first via in the core layer, wherein the first inductor is configured to generate a magnetic field that laterally traverses the package substrate.

22. The method of claim 21, further comprising forming a first pad such that the first pad is coupled to the first inductor, wherein the first pad is configured to couple to a solder ball.

23. The method of claim 22, wherein the first inductor is configured to provide an impedance difference between the first pad and a signal interconnect of 2.5 ohms or less.

24. The method of claim 21, wherein forming the first inductor comprises:

forming a first set of vias; and

forming a first set of interconnects.

25. The method of claim 21, further comprising:

forming a second via located in the core layer; and

forming a second inductor in the first dielectric layer such that the second inductor is coupled to the second via in the core layer.

26. The method of claim 25, wherein the first inductor is positioned in the first dielectric layer such that the magnetic field that is generated by the first inductor affects the impedance of a pad coupled to the second inductor.

27. The method of claim 25, wherein the first inductor is positioned in the first dielectric layer such that the magnetic field that is generated by the first inductor amplifies a magnetic field that is generated by the second inductor.

28. The method of claim 25, wherein the second inductor is configured to generate a magnetic field that laterally traverses the package substrate.

29. The method of claim 21, further comprising:

forming a second dielectric layer coupled to the second surface of the core layer; and

forming a set of interconnects in the second dielectric layer, the set of interconnects coupled to the via in the core layer.

30. The method of claim 21, wherein the package substrate is incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, and/or a laptop computer.