THERMAL MANAGEMENT FOR HEAD-WORN COMPUTER

• US 20160085278A1
• Filed: 09/18/2014
• Published: 03/24/2016
• Est. Priority Date: 09/18/2014
• Status: Active Grant

• Current Assignee: Mentor Acquisition One, LLC (Magic Leap, Inc.)
• Original Assignee: Osterhout Design Group
• Inventors: Osterhout, Ralph F., Lohse, Robert Michael, Huynh, Michael Van
• Granted Patent: US 9,423,842 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G02B 2027/0178 Eyeglass type eyeglass details G02C
• CPC Class Codes: G02B 27/017 Head mounted
• CPC Class Codes: G02B 27/0176 characterised by mechanical features
• CPC Class Codes: G02C 5/143 having special ear pieces
• CPC Class Codes: G06F 1/163 Wearable computers, e.g. on a belt
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: G06F 1/206 comprising thermal management
• CPC Class Codes: H04R 1/1016 Earpieces of the intra-aural type
• CPC Class Codes: H04R 1/1033 Cables or cables storage, e.g. cable reels cord reels per se H02G11/02; arrangements for storing and repeatedly paying-out and re-storing lengths of conductors or cables B65H75/34; extensible conductors or cables, e.g. self-coiling cords H01B7/06
• CPC Class Codes: H04R 2420/09 Applications of special connectors, e.g. USB, XLR, in loudspeakers, microphones or headphones
• CPC Class Codes: H05K 7/20409 Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

Abstract

Aspects of the present invention relate to thermal management systems for head-worn computers.

Claims

1. A head-worn computer, comprising:

a. An upper compartment adapted to contain a processor, memory, and a sensor system, the upper compartment positioned above a lens assembly and including a top plate;

b. The top plate including a processor connection pad mechanically adapted to facilitate the connection between the processor and the top plate;

c. A thermally conductive material positioned between the processor connection pad and the processor to reduce an air gap and to further facilitate the thermal connection between the processor and the top plate; and

d. The top plate further having heat dissipation fins adapted to dissipate heat received from the processor.