Electronic Device, Electronic Apparatus, and Moving Object
First Claim
Patent Images
1. An electronic device comprising:
- an vibration element including an vibration body provided with an adjustment section, an electrode disposed on the vibration body, and a connection electrode electrically connected to the electrode;
a semiconductor substrate so disposed that the semiconductor substrate faces the vibration element;
a connection pad disposed between the semiconductor substrate and the vibration element and electrically connected to the connection electrode via a conductive connection member;
a wiring line electrically connected to the connection pad and located between the connection pad and the semiconductor substrate; and
a protective layer located between the wiring line and the vibration element and disposed in a portion where the adjustment section overlaps with the wiring line in a plan view.
2 Assignments
0 Petitions
Accused Products
Abstract
An electronic device includes an vibration element including an vibration body provided with an adjustment section, an electrode disposed on the vibration body, and a connection electrode electrically connected to the electrode, an IC so disposed that the IC faces the vibration element, terminals disposed on the side facing the upper surface of the IC and electrically connected to the connection electrode via a fixing member, wiring sections electrically connected to the terminals and located below the terminals, and a protective layer located above the wiring sections and disposed in a portion where the adjustment section overlaps with the wiring sections in a plan view.
29 Citations
20 Claims
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1. An electronic device comprising:
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an vibration element including an vibration body provided with an adjustment section, an electrode disposed on the vibration body, and a connection electrode electrically connected to the electrode; a semiconductor substrate so disposed that the semiconductor substrate faces the vibration element; a connection pad disposed between the semiconductor substrate and the vibration element and electrically connected to the connection electrode via a conductive connection member; a wiring line electrically connected to the connection pad and located between the connection pad and the semiconductor substrate; and a protective layer located between the wiring line and the vibration element and disposed in a portion where the adjustment section overlaps with the wiring line in a plan view. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification
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Current AssigneeColumbia Peak Ventures, LLC (Dominion Harbor Enterprises, LLC)
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Original AssigneeSeiko Epson Corporation (Seiko Group)
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InventorsShimura, Masashi, Nomiya, Takashi
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Granted Patent
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Time in Patent OfficeDays
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Field of Search
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US Class Current1/1
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CPC Class CodesG01C 19/5628 Manufacturing; Trimming; Mo...H01L 2224/48091 ArchedH01L 2224/73265 Layer and wire connectorsH01L 2924/00014 the subject-matter covered ...H01L 2924/16195 Flat cap [not enclosing an ...
