ACTIVE-BY-ACTIVE PROGRAMMABLE DEVICE
First Claim
1. An integrated circuit (IC) system, comprising:
- a package substrate having a programmable integrated circuit (IC) die and a companion IC die mounted thereon, the programmable IC die including a programmable fabric and the companion IC die including application circuitry;
a system-in-package (SiP) bridge including a first SiP IO circuit disposed in the programmable IC die, a second SiP IO circuit disposed in the companion IC die, and conductive interconnect on the package substrate electrically coupling the first SiP IO circuit and the second SiP IO circuit;
first aggregation and first dispersal circuits in the programmable IC die coupled between the programmable fabric and the first SiP IO circuit; and
second aggregation and second dispersal circuits in the companion IC die coupled between the application IO and the second SiP IO circuit.
1 Assignment
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Accused Products
Abstract
An example integrated circuit (IC) system includes a package substrate having a programmable integrated circuit (IC) and a companion IC mounted thereon, the programmable IC including a programmable fabric and the companion IC including application circuitry. The IC system further includes a system-in-package (SiP) bridge including a first SiP IO circuit disposed in the programmable IC, a second SiP IO circuit disposed in the companion IC, and conductive interconnect on the package substrate electrically coupling the first SiP IO circuit and the second SiP IO circuit. The IC System further includes first aggregation and first dispersal circuits in the programmable IC coupled between the programmable fabric and the first SiP IO circuit. The IC system further includes second aggregation and second dispersal circuits in the companion IC coupled between the application circuitry and the second SiP IO circuit.
20 Citations
20 Claims
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1. An integrated circuit (IC) system, comprising:
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a package substrate having a programmable integrated circuit (IC) die and a companion IC die mounted thereon, the programmable IC die including a programmable fabric and the companion IC die including application circuitry; a system-in-package (SiP) bridge including a first SiP IO circuit disposed in the programmable IC die, a second SiP IO circuit disposed in the companion IC die, and conductive interconnect on the package substrate electrically coupling the first SiP IO circuit and the second SiP IO circuit; first aggregation and first dispersal circuits in the programmable IC die coupled between the programmable fabric and the first SiP IO circuit; and second aggregation and second dispersal circuits in the companion IC die coupled between the application IO and the second SiP IO circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A programmable integrated circuit (IC), comprising:
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a system-in-package (SiP) input/output (IO) circuit configured to be coupled to a companion IC through external conductive interconnect; a programmable fabric without at least a portion of application circuitry; and aggregation and dispersal circuits coupled between the programmable fabric and the SiP IO circuit. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A method of transmitting data from a programmable integrated circuit (IC) in an IC system, the method comprising:
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coupling the data to a first system-in-package (SiP) IO circuit through a plurality of channels of an aggregation circuit in the programmable IC; transmitting the data from the plurality of channels over a smaller number of physical channels between the programmable IC and a companion IC; receiving the data from the plurality of physical channels at a second SiP IO circuit in the companion IC; and coupling the data from the second SiP IO circuit to application circuitry in the companion IC through a plurality of channels of a dispersal circuit in the companion IC. - View Dependent Claims (17, 18, 19, 20)
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Specification