WICKLESS CAPILLARY DRIVEN CONSTRAINED VAPOR BUBBLE HEAT PIPES FOR APPLICATION IN ELECTRONIC DEVICES WITH VARIOUS SYSTEM PLATFORMS

• US 20170318702A1
• Filed: 12/28/2016
• Published: 11/02/2017
• Est. Priority Date: 04/29/2016
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Basu, Sumita, Kulkarni, Shantanu D., Ghosh, Prosenjit, Kouliachev, Konstantin I.
• Granted Patent: US 10,694,641 B2
• Time in Patent Office: Days
• CPC Class Codes: F28C 3/08 with change of state, e.g. absorption, evaporation, condensation generating steam under pressure F22
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/025 having non-capillary condensate return means
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28D 15/0283 Means for filling or sealing heat pipes
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure
• CPC Class Codes: F28D 2015/0225 Microheat pipes
• CPC Class Codes: F28D 2021/0029 Heat sinks
• CPC Class Codes: F28F 13/16 by applying an electrostatic field to the body of the heat-exchange medium
• CPC Class Codes: F28F 2215/06 Hollow fins; fins with internal circuits
• CPC Class Codes: G02B 6/0085 Means for removing heat created by the light source from the package heat extraction or cooling elements for semiconductor light sources in general H01L33/64
• CPC Class Codes: G02F 1/133385 with cooling means, e.g. fans
• CPC Class Codes: G06F 1/1601 Constructional details related to the housing of computer displays, e.g. of CRT monitors, of flat displays constructional details related to flat displays integrated in a portable computer, e.g. laptop, handheld computer G06F1/1637; constructional details related to television receivers H04N5/64
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H01L 21/4846 Leads on or in insulating or insulated substrates, e.g. metallisation H01L21/4821 takes precedence; metallisation of ceramics in general C04B41/51; printed circuits H05K3/00
• CPC Class Codes: H01L 21/4871 Bases, plates or heatsinks
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H05K 1/0203 : Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0272 : Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 1/185 : Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2201/064 : Fluid cooling, e.g. by integral pipes
• CPC Class Codes: H05K 3/0017 : Etching of the substrate by chemical or physical means
• CPC Class Codes: H05K 3/0044 : Mechanical working of the substrate, e.g. drilling or punching H05K3/0008 takes precedence
• CPC Class Codes: H05K 5/0017 : with operator interface units
• CPC Class Codes: H05K 7/20318 : Condensers
• CPC Class Codes: H05K 7/20336 : Heat pipes, e.g. wicks or capillary pumps
• CPC Class Codes: H05K 7/20809 : within server blades for removing heat from heat source

Abstract

A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms are disclosed. An example embodiment includes: a substrate; and a plurality of wickless capillary driven constrained vapor bubble heat pipes embedded in the substrate, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.

Claims

1. An apparatus comprising:

a substrate; and

a plurality of wickless capillary driven constrained vapor bubble heat pipes embedded in the substrate, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.

2. The apparatus of claim 1 wherein the substrate is of a type from the group consisting of:

a printed circuit board (PCB), an electronic circuit board, a motherboard, a circuit board with embedded integrated circuit (IC) devices, a circuit board with embedded semiconductor or silicon devices, a chassis, a housing, an enclosure, and a support structure of an electronic device.

3. The apparatus of claim 1 wherein the plurality of wickless capillary driven constrained vapor bubble heat pipes are embedded in the substrate in a generally orthogonal orientation.

4. The apparatus of claim 1 wherein the plurality of wickless capillary driven constrained vapor bubble heat pipes are embedded in the substrate in a generally radial orientation.

5. The apparatus of claim 1 wherein the plurality of wickless capillary driven constrained vapor bubble heat pipes are embedded in the substrate in a generally cross-pattern orientation.

6. The apparatus of claim 1 wherein the plurality of wickless capillary driven constrained vapor bubble heat pipes are embedded in the substrate in a separate layer of the substrate.

8. The system of claim 6 wherein the substrate is of a type from the group consisting of:

a printed circuit board (PCB), an electronic circuit board, a motherboard, a circuit board with embedded integrated circuit (IC) devices, a circuit board with embedded semiconductor or silicon devices, a chassis, a housing, an enclosure, and a support structure of an electronic device.

9. The system of claim 6 wherein the plurality of wickless capillary driven constrained vapor bubble heat pipes are embedded in the substrate in a generally orthogonal orientation.

7. A system comprising:

an electronic device embedded on a substrate; and

a plurality of wickless capillary driven constrained vapor bubble heat pipes embedded in the substrate, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.

10. A method comprising:

fabricating an electronic circuit into a substrate; and

fabricating a plurality of embedded wickless capillary driven constrained vapor bubble heat pipes into the substrate, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.

11. The method of claim 10 wherein the substrate is of a type from the group consisting of:

a printed circuit board (PCB), an electronic circuit board, a motherboard, a circuit board with embedded integrated circuit (IC) devices, a circuit board with embedded semiconductor or silicon devices, a chassis, a housing, an enclosure, and a support structure of an electronic device.

12. The method of claim 10 wherein the plurality of wickless capillary driven constrained vapor bubble heat pipes are embedded in the substrate in a generally radial orientation.

13. The method of claim 10 wherein the plurality of wickless capillary driven constrained vapor bubble heat pipes are embedded in the substrate using a chemical etching process.

14. The method of claim 10 wherein the plurality of wickless capillary driven constrained vapor bubble heat pipes are embedded in the substrate using a mechanical subtraction process.

15. The method of claim 10 including filling the capillary with the wettable liquid and sealing the wettable liquid into the capillary.

16. An apparatus comprising:

a substrate; and

a plurality of wickless heat dissipation means embedded in the substrate, each wickless heat dissipation means including a body having an in-built channel means therein with generally square corners and a high energy interior surface, and a fluid means partially filling the in-built channel means to dissipate heat between an evaporator region and a condenser region.

17. The apparatus of claim 16 wherein the substrate is of a type from the group consisting of:

a printed circuit board (PCB), an electronic circuit board, a motherboard, a circuit board with embedded integrated circuit (IC) devices, a circuit board with embedded semiconductor or silicon devices, a chassis, a housing, an enclosure, and a support structure of an electronic device.

18. The apparatus of claim 16 wherein the plurality of wickless heat dissipation means are embedded in the substrate in a generally orthogonal orientation.

19. The apparatus of claim 16 wherein the plurality of wickless heat dissipation means are embedded in the substrate in a generally radial orientation.

20. The apparatus of claim 16 wherein the plurality of wickless heat dissipation means are embedded in the substrate in a generally cross-pattern orientation.