MEMS DEVICE, LIQUID EJECTING HEAD, MANUFACTURING METHOD OF MEMS DEVICE, AND MANUFACTURING METHOD OF LIQUID EJECTING HEAD
First Claim
1. An MEMS device in which a first substrate provided with a driving element and a second substrate protecting the driving element are bonded to each other with an adhesive,wherein the driving element is formed inside the space surrounded by the adhesive between the first substrate and the second substrate,wherein an open hole which communicates with the space and the outside of the adhesive is formed on the adhesive, andwherein an end of the outside of the open hole is provided to be with an end of the first substrate and an end of the second substrate.
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Accused Products
Abstract
There is provided an MEMS device in which a first substrate provided with a driving element and a second substrate protecting the driving element are bonded to each other with an adhesive, in which the driving element is formed inside the space surrounded by the adhesive between the first substrate and the second substrate, an open hole which communicates with the space and the outside of the adhesive is formed on the adhesive, and an end of the outside of the open hole is provided to be with an end of the first substrate and an end of the second substrate.
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Citations
10 Claims
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1. An MEMS device in which a first substrate provided with a driving element and a second substrate protecting the driving element are bonded to each other with an adhesive,
wherein the driving element is formed inside the space surrounded by the adhesive between the first substrate and the second substrate, wherein an open hole which communicates with the space and the outside of the adhesive is formed on the adhesive, and wherein an end of the outside of the open hole is provided to be with an end of the first substrate and an end of the second substrate.
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7. A manufacturing method of an MEMS device in which a first substrate provided with a driving element and a second substrate protecting the driving element are bonded to each other with an adhesive having photosensitivity, the driving element is formed on the inside of the space surrounded by the adhesive between the first substrate and the second substrate, and an open hole is formed on the adhesive which communicates with the inside and the outside of the space, the method comprising:
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forming an adhesive to any one of a first mother substrate including the first substrate and a second mother substrate including the second substrate; bonding the first mother substrate and the second mother substrate using the adhesive; and dividing the bonded substrate of which the first mother substrate and the second mother substrate are bonded to each other into an individual bonded substrate of which the first mother substrate and the second mother substrate are bonded to each other, wherein, in a state before the bonded substrate is divided into the individual bonded substrate, between the first mother substrate and the second mother substrate, a plurality of individual spaces are formed, and the adjacent spaces communicate with each other through a process open hole formed on the adhesive, and wherein, in the dividing, the individual open hole corresponding to the individual bonded substrate is formed by dividing the process open hole. - View Dependent Claims (8, 9, 10)
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Specification