MEMS DEVICE, LIQUID EJECTING HEAD, MANUFACTURING METHOD OF MEMS DEVICE, AND MANUFACTURING METHOD OF LIQUID EJECTING HEAD

• US 20170368828A1
• Filed: 06/20/2017
• Published: 12/28/2017
• Est. Priority Date: 06/28/2016
• Status: Active Application

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: NAGANUMA, Yoichi, TANAKA, Shuichi, HIRAI, Eiju, HAMAGUCHI, Toshiaki
• Granted Patent: US 10,272,686 B2
• Time in Patent Office: Days
• CPC Class Codes: B41J 2/14233 of film type, deformed by bending and disposed on a diaphragm
• CPC Class Codes: B41J 2/1607 Production of print heads with piezoelectric elements B41J2/1606, B41J2/162 take precedence
• CPC Class Codes: B41J 2/161 of film type, deformed by bending and disposed on a diaphragm
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1626 etching
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1634 laser machining
• CPC Class Codes: B41J 2/1643 thin film formation by plating
• CPC Class Codes: B41J 2/1645 thin film formation by spincoating
• CPC Class Codes: B41J 2002/14241 having a cover around the piezoelectric thin film element
• CPC Class Codes: B41J 2002/14491 Electrical connection
• CPC Class Codes: B41J 2202/11 characterised by specific geometrical characteristics
• CPC Class Codes: B41J 2202/18 Electrical connection established using vias

Abstract

There is provided an MEMS device in which a first substrate provided with a driving element and a second substrate protecting the driving element are bonded to each other with an adhesive, in which the driving element is formed inside the space surrounded by the adhesive between the first substrate and the second substrate, an open hole which communicates with the space and the outside of the adhesive is formed on the adhesive, and an end of the outside of the open hole is provided to be with an end of the first substrate and an end of the second substrate.

Claims

1. An MEMS device in which a first substrate provided with a driving element and a second substrate protecting the driving element are bonded to each other with an adhesive,

wherein the driving element is formed inside the space surrounded by the adhesive between the first substrate and the second substrate,

wherein an open hole which communicates with the space and the outside of the adhesive is formed on the adhesive, and

wherein an end of the outside of the open hole is provided to be with an end of the first substrate and an end of the second substrate.

2. The MEMS device according to claim 1,

wherein the first substrate is configured with a main substrate and a stacked member which is stacked on the main substrate, and

wherein an end of the main substrate is provided to be with the end of the outside of the open hole.

3. The MEMS device according to claim 2,

wherein the first substrate includes an overlapping part overlapping with at least open hole in a stacking direction of the first substrate, the adhesive, and the second substrate, and

wherein an end of the overlapping part of the main substrate is provided to be with the end of the second substrate, and an end of a part deviated from the overlapping part of the main substrate is formed on the inside further than the end of the second substrate.

4. A liquid ejecting head comprising a structure of the MEMS device according to claim 1,

wherein the driving element is a piezoelectric element, the first substrate is a substrate including a pressure chamber forming substrate in which a pressure chamber is provided on a region corresponding to the piezoelectric element, and the open hole is an atmosphere open hole which opens a space to an atmosphere.

5. A liquid ejecting head comprising a structure of the MEMS device according to claim 2,

wherein the driving element is a piezoelectric element, the first substrate is a substrate including a pressure chamber forming substrate in which a pressure chamber is provided on a region corresponding to the piezoelectric element, and the open hole is an atmosphere open hole which opens a space to an atmosphere.

6. A liquid ejecting head comprising a structure of the MEMS device according to claim 3,

wherein the driving element is a piezoelectric element, the first substrate is a substrate including a pressure chamber forming substrate in which a pressure chamber is provided on a region corresponding to the piezoelectric element, and the open hole is an atmosphere open hole which opens a space to an atmosphere.

7. A manufacturing method of an MEMS device in which a first substrate provided with a driving element and a second substrate protecting the driving element are bonded to each other with an adhesive having photosensitivity, the driving element is formed on the inside of the space surrounded by the adhesive between the first substrate and the second substrate, and an open hole is formed on the adhesive which communicates with the inside and the outside of the space, the method comprising:

forming an adhesive to any one of a first mother substrate including the first substrate and a second mother substrate including the second substrate;

bonding the first mother substrate and the second mother substrate using the adhesive; and

dividing the bonded substrate of which the first mother substrate and the second mother substrate are bonded to each other into an individual bonded substrate of which the first mother substrate and the second mother substrate are bonded to each other,

wherein, in a state before the bonded substrate is divided into the individual bonded substrate, between the first mother substrate and the second mother substrate, a plurality of individual spaces are formed, and the adjacent spaces communicate with each other through a process open hole formed on the adhesive, and

wherein, in the dividing, the individual open hole corresponding to the individual bonded substrate is formed by dividing the process open hole.

8. The manufacturing method of the MEMS device according to claim 7, further comprising, after the bonding substrate:

removing the first mother substrate on a region deviated from a region corresponding to the process open hole in a division line which is a boundary of the individual first substrate, from a surface opposite to the second mother substrate in the plate thickness direction, before the dividing.

9. A manufacturing method of a liquid ejecting head according to claim 7, to which the method is applied,

wherein a driving element is a piezoelectric element, a first substrate is a substrate including a pressure chamber forming substrate in which a pressure chamber is provided in a region corresponding to the piezoelectric element, and the open hole is an atmosphere open hole which opens a space to the atmosphere.

10. A manufacturing method of a liquid ejecting head according to claim 8, to which the method is applied,

wherein a driving element is a piezoelectric element, a first substrate is a substrate including a pressure chamber forming substrate in which a pressure chamber is provided in a region corresponding to the piezoelectric element, and the open hole is an atmosphere open hole which opens a space to the atmosphere.