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SEMICONDUCTOR PACKAGE AND METHODS OF FORMING THE SAME

  • US 20200135567A1
  • Filed: 04/30/2019
  • Published: 04/30/2020
  • Est. Priority Date: 10/31/2018
  • Status: Active Grant
First Claim
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1. A method of forming a semiconductor device, the method comprising:

  • forming a first dielectric layer over a passivation layer of a die and over a die connector of the die, the die connector extending through the passivation layer;

    curing the first dielectric layer, wherein after curing the first dielectric layer, the first dielectric layer has a curved upper surface distal to the passivation layer, wherein the curved upper surface comprises;

    a first region over the die connector; and

    a second region laterally adjacent to the die connector, wherein the first region extends further from the passivation layer than the second region, wherein a first distance between the first region and the second region is larger than a first pre-determined threshold;

    forming a second dielectric layer over the cured first dielectric layer; and

    curing the second dielectric layer, wherein after curing the second dielectric layer, an upper surface of the second dielectric layer distal to the passivation layer comprises;

    a third region over the first region; and

    a fourth region over the second region, wherein a second distance between the third region and the fourth region is smaller than the first pre-determined threshold.

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