SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDCUTOR PACKAGE
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Accused Products
Abstract
A semiconductor package includes an encapsulated semiconductor device, a first redistribution structure, an insulating layer, and an antenna. The encapsulated semiconductor device includes a semiconductor device encapsulated by an encapsulation material. The redistribution structure is disposed on a first side the encapsulated semiconductor device and electrically connected to the semiconductor device. The insulating layer is disposed on a second side of the encapsulated semiconductor device and comprises a groove pattern. The antenna is filled the groove pattern, wherein an upper surface of the antenna is substantially coplanar with an upper surface of the insulating layer.
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Citations
35 Claims
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1-15. -15. (canceled)
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16. A manufacturing method of a semiconductor package, comprising:
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forming an encapsulated semiconductor device on a carrier; forming a first redistribution structure on a first side of the encapsulated semiconductor device; removing the carrier from the encapsulated semiconductor device; forming an insulating layer on a second side of the encapsulated semiconductor device where the carrier is removed from; forming a groove pattern on the insulating layer; filling a conductive paste in the groove pattern; and performing a curing process on the conductive paste to form an antenna in the groove pattern, wherein an upper surface of the antenna is substantially coplanar with an upper surface of the insulating layer. - View Dependent Claims (17, 18, 19, 20)
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21. A method, comprising:
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placing a semiconductor device on a first-side redistribution structure; encapsulating a semiconductor device with an encapsulating material placed on the first-side redistribution structure; forming a second-side redistribution structure on the encapsulating material and the semiconductor device encapsulated by the encapsulating material; after forming the second-side redistribution structure, forming an insulating layer on the first-side redistribution structure; forming a groove pattern on the insulating layer; and filling a conductive paste in the groove pattern and curing the conductive paste to form an antenna in the groove pattern. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 35)
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30. A method, comprising:
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providing an encapsulated semiconductor device comprising a first-side redistribution structure and a second second-side redistribution structure disposed on opposite sides thereof; forming an insulating layer covering the first-side redistribution structure; forming a groove pattern on the insulating layer; filling a conductive paste in the groove pattern such that slope of tapered sidewalls of the conductive paste is controlled by the groove pattern; and curing the conductive paste filled in the groove pattern. - View Dependent Claims (31, 32, 33, 34)
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Specification