Face to face chip
First Claim
Patent Images
1. A method of fabricating an integrated circuit device, comprising:
- providing a plurality of first dice, said first dice each having signal pads formed on a surface thereof;
providing a plurality of second dice, said second dice each having signal pads formed on a surface thereof; and
arranging said first dice so that each of said first dice overlaps at least three of said second dice, and each of said second dice overlaps at least three of said first dice, thereby defining overlap areas, wherein at least some signal pads of said plurality of first dice are configured to be capactively coupled to corresponding signal pads of said second dice in said overlap areas.
0 Assignments
0 Petitions
Accused Products
Abstract
An integrated circuit device includes first and second arrays of semiconductor dice. Each array of dice is arranged in face-to-face relation to the other array of dice, thus forming a lower layer of dice and an upper layer of dice. The layers are aligned so that each upper layer die straddles two or more of the lower layer dice, thus defining overlap regions. In the overlap regions, signal pads of one layer are aligned with corresponding signal pads of the other layer. The two layers are spaced apart, thus creating a capacitance-based communication path between the upper and lower layers via the signal paths.
-
Citations
20 Claims
-
1. A method of fabricating an integrated circuit device, comprising:
-
providing a plurality of first dice, said first dice each having signal pads formed on a surface thereof;
providing a plurality of second dice, said second dice each having signal pads formed on a surface thereof; and
arranging said first dice so that each of said first dice overlaps at least three of said second dice, and each of said second dice overlaps at least three of said first dice, thereby defining overlap areas, wherein at least some signal pads of said plurality of first dice are configured to be capactively coupled to corresponding signal pads of said second dice in said overlap areas. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
arranging said first dice to form a first two-dimensional repeating pattern; and
arranging said second dice to form a second two-dimensional repeating pattern.
-
-
8. The method of claim 1 further comprising:
capacitively coupling some signal pads of said first dice to some signal pads of said second dice in said overlap areas.
-
9. A method of fabricating an integrated circuit device, comprising:
-
providing a plurality of first dice, said first dice each having first signal pads formed on a surface thereof;
providing a plurality of second dice, said second dice each having second signal pads formed on a surface thereof; and
arranging said first dice so that each first die overlaps at least two of said second dice, thereby defining overlap areas, wherein said first signal pads located in said overlap areas are configured to be capactively coupled to some of said second signal pads, wherein said first dice or said second dice have raised areas relative to said surfaces, the raised areas of each of said first or said second die contacting an area on one of the overlapping die. - View Dependent Claims (10, 11, 12, 13, 14)
-
-
15. A method of fabricating an integrated circuit device, comprising:
-
providing a plurality of first dice, said first dice each having signal pads formed on a surface thereof;
providing a plurality of second dice, said second dice each having signal pads formed on a surface thereof;
arranging said first dice so that each first die overlaps at least four of said second dice, thereby defining overlap areas; and
aligning said first dice so that signal pads thereof located in said overlap areas are configured to be capactively coupled to some signal pads of said second dice. - View Dependent Claims (16, 17, 18, 19, 20)
-
Specification