Integrated circuit cooling apparatus

• US 6,543,246 B2
• Filed: 07/24/2001
• Issued: 04/08/2003
• Est. Priority Date: 07/24/2001
• Status: Expired due to Fees

• Current Assignee: Delta Design Incorporated (COHU Incorporated)
• Original Assignee: KryoTech, Inc. (COHU Incorporated)
• Inventors: Hayes, Andrew M., Gage, Derek E., Wayburn, Lewis S., Niles, David W., Barker, R. Walton
• Primary Examiner(s): DOERRLER, WILLIAM CHARLES
• Application Number:
  US09/911,865
• Publication Number:
  US 20030019234A1
• Time in Patent Office: 623 Days
• Field of Search: 622/592, 622/76, 627/01, 361/700, 361/719, 361/710
• US Class Current: 62/259.2
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An apparatus for cooling a computer'"'"'s microprocessor includes a thermal housing having a receiving aperture in alignment with the microprocessor. A thermal head is inserted into and guided by the receiving aperture such that a cooled surface of the thermal head will be in thermal contact with the microprocessor. The thermal head defines a flow channel for passage of a refrigerant fluid so as to cause cooling at the cooled surface. A clamping arrangement is attached to the mounting structure to maintain the thermal head in operative position. The apparatus further includes a refrigeration system in fluid communication with the flow channel of the thermal head to supply refrigerant fluid thereto.

Claims

1. An apparatus for cooling an electronic device, said apparatus comprising:

a mounting structure having a receiving aperture in axial alignment with a top surface of said electronic device;

a thermal head movable with respect to said mounting structure, said thermal head adapted to be inserted into and guided by said receiving aperture such that a cooled surface of said thermal head will be in thermal contact with said top surface of said electronic device;

said thermal head defining a flow channel for passage of a refrigerant fluid so as to cause cooling at said cooled surface;

a clamping arrangement attached to said mounting structure to maintain said thermal head in operative position; and

a refrigeration system in fluid communication with said flow channel of said thermal head to supply refrigerant fluid thereto.

2. An apparatus as set forth in claim 1, wherein said mounting structure comprises a thermal housing having an interior in which said electronic device is located, said thermal housing serving to isolate said interior thereof from an ambient environment.

3. An apparatus as set forth in claim 2, wherein said thermal housing is formed of thermally conductive material.

4. An apparatus as set forth in claim 3, wherein said mounting structure is formed of aluminum.

5. An apparatus as set forth in claim 3, wherein said mounting structure includes a heater element operative to heat an outer surface thereof so as to prevent condensation from forming thereon.

6. An apparatus as set forth in claim 3, wherein said mounting structure is fixed to a circuit board on which said electronic device is mounted.

7. An apparatus as set forth in claim 1, wherein said thermal head is axially movable in said receiving aperture, said clamping arrangement including a spring element to urge said thermal head into engagement with said electronic device.

8. An apparatus as set forth in claim 7, wherein said thermal head includes a peripheral seal engaging an inner wall of said receiving aperture.

9. An apparatus as set forth in claim 8, wherein said receiving aperture and said thermal head each have a generally cylindrical configuration.

10. An apparatus as set forth in claim 1, wherein said thermal head is removably secured by said clamping arrangement with respect to said mounting structure.

11. An apparatus as set forth in claim 10, wherein said clamping arrangement includes a clamping flange movable with respect to said thermal head, said clamping flange being fixed with respect to said mounting structure when attached thereto.

14. An apparatus as set forth in claim 1, wherein said refrigerant fluid is respectively conducted to and from said thermal head via an inlet and an outlet tube, said inlet tube being located inside of said outlet tube.

15. An apparatus as set forth in claim 14, wherein said inlet tube and said outlet tube are sufficiently flexible to provide mechanical isolation to said thermal head.

16. An apparatus as set forth in claim 15, wherein said outlet tube is a corrugated metal tube.

17. An apparatus as set forth in claim 15, wherein said inlet tube is a capillary tube.

18. An apparatus as set forth in claim 1, wherein said flow channel of said thermal head has a configuration generally characterized by a plurality of arcuate and concentric passage segments.

12. An apparatus for cooling an electronic device, said apparatus comprising:

a mounting structure having a receiving aperture in alignment with said electronic device;

a thermal head adapted to be inserted into and guided by said receiving aperture such that a cooled surface of said thermal head will be in thermal contact with said electronic device;

said thermal head defining a flow channel for passage of a refrigerant fluid so as to cause cooling at said cooled surface;

a clamping arrangement attached to said mounting structure to removably secure said thermal head in operative position with respect to said mounting structure, said clamping arrangement including a clamping flange movable with respect to said thermal head but fixed with respect to said mounting structure when attached thereto, said clamping arrangement further including a clamping collar movable with respect to said clamping flange and said thermal head; and

a refrigeration system in fluid communication with said flow channel of said thermal head to supply refrigerant fluid thereto.

13. An apparatus as set forth in claim 12, wherein said clamping arrangement further comprises a spring element to urge said thermal head into engagement with said electronic device, said spring element being located between said clamping collar and said thermal head.

19. A thermal housing for attachment to a planar circuit board having thereon at least one electronic device to be cooled, said thermal housing comprising:

a removable first housing member located on a first side of said circuit board, said first housing member defining an interior in which said electronic device is located so as to define an air pocket surrounding said electronic device;

a removable second housing member located on a second side of said circuit board opposite to said first housing member such that said circuit board will be sandwiched therebetween;

at least said first housing member being formed substantially entirely of a thermally conductive material, said electronic device being thermally insulated from said first housing member by said air pocket; and

a first heater element associated with said first housing member to heat an outer surface thereof so as to prevent condensation from forming thereon.

21. A thermal housing as set forth in claim 19, wherein said second housing member is formed of a thermally conductive material.

22. A thermal housing as set forth in claim 21, further comprising a second heater element associated with said second housing member to heat an outer surface thereof so as to prevent condensation from forming thereon.

23. A thermal housing as set forth in claim 21, wherein said first and second housing members are formed of aluminum.

24. A thermal housing as set forth in claim 19, further comprising first and second resilient seals respectively located between said first and second housing members and said circuit board.

25. A thermal housing as set forth in claim 24, wherein said first and second housing members are secured in position on said circuit board by a plurality of through-bolts.

26. A thermal housing as set forth in claim 19, wherein said first housing member has a block portion defining a receiving aperture in which a thermal head of a cooling apparatus is inserted and a wall portion defining a thin wall for engagement with said circuit board.

29. A thermal housing as set forth in claim 26, wherein said receiving aperture has a cylindrical configuration.

30. A thermal housing as set forth in claim 19, further comprising a desiccant material located in said interior of said first housing member to absorb moisture located therein.

20. A thermal housing for attachment to a planar circuit board having thereon at least one electronic device to be cooled, said thermal housing comprising:

a removable first housing member located on a first side of said circuit board, said first housing member defining an interior in which said electronic device is located;

a removable second housing member located on a second side of said circuit board opposite to said first housing member such that said circuit board will be sandwiched therebetween;

at least said first housing member being formed of a thermally conductive material;

a first heater element associated with said first housing member to heat an outer surface thereof so as to prevent condensation from forming thereon; and

said first housing member defining a first groove on said outer surface, said first heater element being located in said groove.

27. A thermal housing for attachment to a planar circuit board having thereon at least one electronic device to be cooled, said thermal housing comprising:

a removable first housing member located on a first side of said circuit board, said first housing member defining an interior in which said electronic device is located;

said first housing member having a block portion defining a receiving aperture in which a thermal head of a cooling apparatus is inserted and a wall portion defining a thin wall for engagement with said circuit board, said thin wall of said first housing member being configured to define a path around electronic components mounted to said circuit board;

a removable second housing member located on a second side of said circuit board opposite to said first housing member such that said circuit board will be sandwiched therebetween;

at least said first housing member being formed of a thermally conductive material; and

a first heater element associated with said first housing member to heat an outer surface thereof so as to prevent condensation from forming thereon.

28. A thermal housing as set forth in claim 27, wherein said first housing member is formed entirely of metal.

31. An apparatus comprising:

a planar circuit board having thereon at least one electronic device to be cooled;

a thermal housing having a removable first housing member and a removable second housing member;

said first housing member located on a first side of said circuit board and defining an interior in which said electronic device is located;

said first housing member further defining a receiving aperture in alignment with said electronic device;

a thermal head adapted to be inserted into and guided by said receiving aperture such that a cooled surface of said thermal head will be in thermal contact with said electronic device, said thermal head being axially movable in said receiving aperture; and

said second housing member being located on a second side of said circuit board opposite to said first housing member such that said circuit board will be sandwiched therebetween.

32. An apparatus as set forth in claim 31, wherein each of said housing members is constructed of a thermally conductive material.

33. An apparatus as set forth in claim 32, wherein said first and second housing members are formed of aluminum.

34. An apparatus as set forth in claim 32, further comprising a respective heater element associated with each of said housing members to heat an outer surface thereof so as to prevent condensation from forming thereon.

36. An apparatus as set forth in claim 31, further comprising first and second resilient seals respectively located between said first and second housing members and said circuit board.

37. An apparatus as set forth in claim 36, wherein said first and second housing members are secured in position on said circuit board by a plurality of through-bolts.

38. An apparatus as set forth in claim 31, wherein said first housing member has a block portion defining a receiving aperture in which a thermal head of a cooling apparatus is inserted and a wall portion defining a thin wall for engagement with said circuit board.

39. An apparatus as set forth in claim 38, wherein said thin wall of said first housing member is configured to define a path around electronic components mounted to said circuit board.

40. An apparatus as set forth in claim 38, further comprising a desiccant material located in said interior of said first housing member to absorb moisture located therein.

41. An apparatus as set forth in claim 31, further comprising means for urging said thermal head into engagement with said electronic device.

42. An apparatus as set forth in claim 31, wherein said thermal head includes a peripheral seal engaging an inner wall of said receiving aperture.

43. An apparatus as set forth in claim 42, wherein said receiving aperture and said thermal head each have a generally cylindrical configuration.

44. An apparatus as set forth in claim 43, wherein said thermal head is removably secured with respect to said first housing member.

35. An apparatus comprising:

a planar circuit board having thereon at least one electronic device to be cooled;

a thermal housing having a removable first housing member and a removable second housing member, each of said housing members being constructed of a thermally conductive material;

said first housing member located on a first side of said circuit board and defining an interior in which said electronic device is located;

said first housing member further defining a receiving aperture in alignment with said electronic device;

a thermal head adapted to be inserted into and guided by said receiving aperture such that a cooled surface of said thermal head will be in thermal contact with said electronic device;

said second housing member being located on a second side of said circuit board opposite to said first housing member such that said circuit board will be sandwiched therebetween;

a respective heater element associated with each of said housing members to heat an outer surface thereof so as to prevent condensation from forming thereon; and

said housing members each defining a groove on said outer surface, said respective heater element being located in said groove.

45. An evaporator for a cooling apparatus used for cooling an electronic device, said evaporator comprising:

a thermal head having a cooled surface for thermal contact with said electronic device;

said thermal head defining a flow channel for passage of a refrigerant fluid so as to cause cooling at said cooled surface, said flow channel having a configuration generally characterized by a plurality of arcuate and concentric passage segments, said flow channel having scalloped sidewalls characteristic of said flow channel being formed by interconnected drill holes;

said flow channel of said thermal head having an inlet and outlet for respective ingress and egress of said refrigerant fluid;

an inlet tube in fluid communication with said inlet of said thermal head; and

an outlet tube in fluid communication with said outlet of said thermal head.

46. An evaporator as set forth in claim 45, wherein said thermal head comprises a first portion and a second portion made of disparate metals, said first portion and said second portion being connected together to yield an integral structure.

47. An evaporator as set forth in claim 46, wherein said first portion of said thermal head is formed of brass and said second portion of said thermal head is formed of copper.

48. An evaporator as set forth in claim 47, wherein said first portion and said second portion of said thermal head are brazed together to yield said integral structure.

49. An evaporator as set forth in claim 45, wherein said thermal head defines a peripheral groove about an outer surface thereof, said peripheral groove having a peripheral seal located therein.

50. An evaporator as set forth in claim 49, wherein said thermal head has a generally cylindrical configuration.

51. An evaporator as set forth in claim 45, wherein said inlet tube is located inside of said outlet tube.

52. An evaporator as set forth in claim 51, wherein said outlet tube is a corrugated metal tube.

53. An evaporator as set forth in claim 51, wherein said inlet tube is a capillary tube.

54. An apparatus for cooling an electronic device, said apparatus comprising:

a mounting structure having a receiving aperture in alignment with said electronic device;

a thermal head axially movable in said receiving aperture such that a cooled surface of said thermal head will be guided in thermal contact with said electronic device;

said thermal head defining a flow passage for passage of a refrigerant fluid so as to cause cooling at said cooled surface; and

a clamping arrangement attached to said mounting structure to maintain said thermal head in operative position, said clamping arrangement including a helical wave spring to urge said thermal head into engagement with said electronic device.

55. An apparatus as set forth in claim 54, wherein said mounting structure is fixed to a circuit board on which said electronic device is mounted.

56. An apparatus as set forth in claim 55, wherein said mounting structure comprises a thermal housing having an interior in which said electronic device is located, said thermal housing serving to isolate said interior thereof from an ambient environment.

60. An apparatus as set forth in claim 54, wherein an inlet tube and an outlet tube are connected to said thermal head for respectively conducting said refrigerant fluid to and from said flow channel, said tubes being sufficiently flexible to provide mechanical isolation to thermal head.

61. An apparatus as set forth in claim 60, wherein said outlet tube is a corrugated metal tube.

62. An apparatus as set forth in claim 61, wherein said inlet tube is a capillary tube.

63. An apparatus as set forth in claim 62, wherein said inlet tube is located inside of said outlet tube.

57. An apparatus for cooling an electronic device, said apparatus comprising:

a mounting structure having a receiving aperture in alignment with said electronic device;

a thermal head axially movable in said receiving aperture such that a cooled surface of said thermal head will be guided in thermal contact with said electronic device, said thermal head including a peripheral seal engaging an inner wall of said receiving aperture;

said thermal head defining a flow passage for passage of a refrigerant fluid so as to cause cooling at said cooled surface; and

a clamping arrangement attached to said mounting structure to maintain said thermal head in operative position, said clamping arrangement including a spring element to urge said thermal head into engagement with said electronic device.

58. An apparatus as set forth in claim 57, wherein said receiving aperture and said thermal head each have a generally cylindrical configuration.

59. An apparatus as set forth in claim 58, wherein said thermal head is removably secured with respect to said mounting structure by said clamping arrangement.

64. An apparatus for cooling an electronic device, said apparatus comprising:

a thermal housing fixed to a circuit board on which said electronic device is mounted and having an interior in which said electronic device is located, said thermal housing serving to surround and cover said electronic device and isolate said interior thereof from an ambient environment;

a desiccant material located in said interior of said thermal housing to absorb moisture located therein;

a thermal head having a cooled surface in thermal contact with said electronic device; and

said thermal head defining a flow channel for passage of a refrigerant fluid so as to cause cooling at said cooled surface.

65. An apparatus as set forth in claim 64, wherein said thermal housing is removably secured with respect to said circuit board.

66. An apparatus as set forth in claim 65, further comprising a resilient seal located between said thermal housing and said circuit board.

67. An apparatus as set forth in claim 66, wherein said thermal housing is formed of a thermally conductive material.

68. An apparatus as set forth in claim 67, further comprising a heater element associated with said thermal housing to heat an outer surface thereof so as to prevent condensation from forming thereon.