Light emitting diode and method for making the same
First Claim
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1. A light emitting diode, comprising:
- an inorganic phosphor;
a silicon compound having one side being at least partially C1-C6 alkyl oxide reacted with the inorganic phosphor to modify the surface property of the inorganic phosphor, and another side including a functional group selected from a group consisting of epoxy, C1-C6 alkyl, phenyl, and amino; and
an organic glue reacted with the functional group;
the phosphor and the silicon compound forming an ultrasonically induced chemical bond one with the other;
whereby the inorganic phosphor with modified surface property can be uniformly combined with the glue.
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Abstract
A light emitting diode and a method for making the same are proposed. The LED comprises an inorganic phosphor, a silicon compound and an organic glue. The silicon compound has one side being completely or partially C1-C6 alkyl oxide reacted with the inorganic phosphor to modify the surface property of the inorganic phosphor and another side being a functional group selected from a group consisting of epoxy, C1-C6 alkyl, phenyl, amino. The inorganic phosphor with modified surface property can be uniformly mixed in the glue and less deposition is produced.
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Citations
10 Claims
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1. A light emitting diode, comprising:
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an inorganic phosphor;
a silicon compound having one side being at least partially C1-C6 alkyl oxide reacted with the inorganic phosphor to modify the surface property of the inorganic phosphor, and another side including a functional group selected from a group consisting of epoxy, C1-C6 alkyl, phenyl, and amino; and
an organic glue reacted with the functional group;
the phosphor and the silicon compound forming an ultrasonically induced chemical bond one with the other;
whereby the inorganic phosphor with modified surface property can be uniformly combined with the glue. - View Dependent Claims (2, 3, 4)
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5. A manufacturing method for light emitting diode, comprising the steps of:
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(a) preparing an inorganic phosphor;
(b) mixing the inorganic phosphor with a silicon compound in an alcoholic solution to form a mixed solution;
(c) ultrasonically shocking and thereafter heating the mixed solution, the inorganic phosphor being responsively reacted with a silicon alkyl oxide to form a surface modified phosphor;
(d) mixing the surface modified phosphor with an organic glue, the phosphor being thereby uniformly suspended within the organic glue. - View Dependent Claims (6, 7, 8, 9, 10)
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Specification