Method of forming a multilayer dielectric stack
First Claim
1. A method of forming a dielectric stack comprising the steps of:
- a) forming a first dielectric layer on an upper surface of a semiconductor substrate, wherein the first dielectric layer comprises a first dielectric material, which is HfO2;
b) forming a second dielectric layer on the first dielectric layer, wherein the second dielectric layer is selected from the group consisting of Al2O3, AlN, SiN, and Si3N4; and
c) forming a third dielectric layer above the second dielectric layer, wherein the third dielectric layer comprises the same dielectric material as the first dielectric material.
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Abstract
A multilayer dielectric stack is provided which has alternating layers of a high-k material and an interposing material. The presence of the interposing material and the thinness of the high-k material layers reduces or eliminate effects of crystallization within the high-k material, even at relatively high annealing temperatures. The high-k dielectric layers are a metal oxide of preferably zirconium or hafnium. The interposing layers are preferably amorphous aluminum oxide, aluminum nitride, or silicon nitride. Because the layers reduce the effects of crystalline structures within individual layers, the overall tunneling current is reduced. Also provided are atomic layer deposition, sputtering, and evaporation as methods of depositing desired materials for forming the above-mentioned multilayer dielectric stack.
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Citations
13 Claims
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1. A method of forming a dielectric stack comprising the steps of:
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a) forming a first dielectric layer on an upper surface of a semiconductor substrate, wherein the first dielectric layer comprises a first dielectric material, which is HfO2;
b) forming a second dielectric layer on the first dielectric layer, wherein the second dielectric layer is selected from the group consisting of Al2O3, AlN, SiN, and Si3N4; and
c) forming a third dielectric layer above the second dielectric layer, wherein the third dielectric layer comprises the same dielectric material as the first dielectric material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification