Light emitting semiconductor package
First Claim
Patent Images
1. A light emitting semiconductor package including:
- a) a semiconductor chip having a top surface and a bottom surface and including at least one light emitting device formed in the chin which can emit electromagnetic radiation, the at least one light emitting device residing on or in the too surface; and
b) a first hollow can including;
(1) a central portion and first perimeter walls extending from the perimeter edge of the central portion with the free edges of the first perimeter walls bonded to the top surface to provide a first cavity;
(2) the central portion overlying at least part or all of the at least one light emitting device; and
(3) at least one region of the central portion which is substantially transparent or translucent to the electromagnetic radiation;
wherein the first hollow cap has been bonded to the semiconductor chip at the wafer stage prior to separation of the wafer into individual packages.
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Accused Products
Abstract
A light emitting semiconductor package (250) has a semiconductor chip (252) with a surface with one or more light emitting devices (254) formed on or in the surface. A cap (256) is bonded to the surface of the chip (252) to encapsulate the devices (254). The cap has one or more regions (258) transparent to light emitted by the light emitting devices (254). The cap has been bonded to the semiconductor chip (252) at the wafer stage prior to separation of the wafer into individual packages.
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Citations
8 Claims
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1. A light emitting semiconductor package including:
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a) a semiconductor chip having a top surface and a bottom surface and including at least one light emitting device formed in the chin which can emit electromagnetic radiation, the at least one light emitting device residing on or in the too surface; and
b) a first hollow can including;
(1) a central portion and first perimeter walls extending from the perimeter edge of the central portion with the free edges of the first perimeter walls bonded to the top surface to provide a first cavity;
(2) the central portion overlying at least part or all of the at least one light emitting device; and
(3) at least one region of the central portion which is substantially transparent or translucent to the electromagnetic radiation;
wherein the first hollow cap has been bonded to the semiconductor chip at the wafer stage prior to separation of the wafer into individual packages. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification