Circuit board with via through surface mount device contact
First Claim
1. A circuit board comprising:
- a first layer and a second layer;
a substrate between the first layer and the second layer;
a first surface mount device pad on the first layer of the substrate, the first surface mount device pad having a first end and a second end;
a first via, the first via being formed partially or wholly through the first end of the first surface mount device pad, the first via passing through the substrate between the first layer and the second layer;
a second surface mount device pad adjacent to the first surface mount device pad, the second surface mount device pad having a first end and a second end, the first end of the first surface mount device pad being adjacent to the first end of the second surface mount device pad and the second end of the first surface mount device pad being adjacent to the second end of the second surface mount device pad; and
a second via, the second via being formed partially or wholly through the second end of the second surface mount device pad, the second via passing through the substrate.
1 Assignment
0 Petitions
Accused Products
Abstract
A circuit board apparatus and a method for a circuit board. An embodiment of a circuit board includes a first layer and a second layer; a substrate between the first layer and the second layer; a first surface mount device pad on the first layer of the substrate; a first via, the first via being formed partially or wholly through a first end of the first surface mount device pad, the first via passing through the substrate between the first layer and the second layer; a second surface mount device pad adjacent to the first surface mount device pad; and a second via, the second via being formed partially or wholly through a first end of the second surface mount device pad, the second via passing through the substrate, the first end of the first surface mount device pad being the end of the first surface mount device pad that is the farthest from the first end of the second surface mount device pad.
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Citations
14 Claims
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1. A circuit board comprising:
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a first layer and a second layer;
a substrate between the first layer and the second layer;
a first surface mount device pad on the first layer of the substrate, the first surface mount device pad having a first end and a second end;
a first via, the first via being formed partially or wholly through the first end of the first surface mount device pad, the first via passing through the substrate between the first layer and the second layer;
a second surface mount device pad adjacent to the first surface mount device pad, the second surface mount device pad having a first end and a second end, the first end of the first surface mount device pad being adjacent to the first end of the second surface mount device pad and the second end of the first surface mount device pad being adjacent to the second end of the second surface mount device pad; and
a second via, the second via being formed partially or wholly through the second end of the second surface mount device pad, the second via passing through the substrate. - View Dependent Claims (2, 3, 4)
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5. A circuit board comprising:
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a first layer and a second layer, the first layer including a first pad and a second pad for installation of an electronic component to the first layer, the first pad and the second pad being adjacent to each other, the first pad and the second pad each having a first end and a second end, the first end of the first pad being adjacent to the first end of the second pad and the second end of the first pad being adjacent to the second end of the second pad;
a first via in the first pad, the first via being formed in the first end of the first pad, the first via passing partially or wholly through the first pad and passing through the circuit board between the first layer and the second layer; and
a second via in the second pad, the second via passing partially or wholly through the second pad, the second via being formed in the second end of the second pad. - View Dependent Claims (6, 7, 8)
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9. A method comprising:
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creating a first surface mount device contact and a second surface mount device contact as a part of a first layer of a circuit board, the first surface mount device contact and the second surface mount contact device being adjacent to each other, the first surface mount device contact and the second surface mount device contact each having a first end and a second end, the first end of the first surface mount device contact being adjacent to the first end of the second surface mount device contact, and the second end of the first surface mount device contact being adjacent to the second end of the second surface mount device contact;
forming a first via wholly or partially through the first surface mount device contact, the first via electrically connecting the first surface mount device contact to a second layer of the circuit board, the first via being formed in the first end of the first surface mount device contact; and
forming a second via wholly or partially through the second surface mount contact device, the second via being formed in the second end of the second surface mount device contact. - View Dependent Claims (10, 11)
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12. A circuit board produced by a process comprising:
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creating a first surface mount device contact as a part of a first layer on a surface of a substrate, the first surface mount device contact having a first end and a second end;
forming a first via wholly or partially through the first end of the first surface mount device contact, the first via electrically connecting the first surface mount device contact to a second layer;
creating a second surface mount device contact as a part of the first layer, the second surface device contact being adjacent to the first surface mount device contact, the second surface mount device contact having a first end and a second end, the first end of the first surface mount device contact being adjacent to the first end of the second surface mount device contact and the second end of the first surface mount device contact being adjacent to the second end of the second surface mount device contact; and
forming a second via wholly or partially through the second end of the second surface mount device contact. - View Dependent Claims (13, 14)
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Specification