Circuit board with via through surface mount device contact

• US 6,803,527 B2
• Filed: 03/26/2002
• Issued: 10/12/2004
• Est. Priority Date: 03/26/2002
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Horine, Bryce, Dishongh, Terrance J.
• Primary Examiner(s): Pert, Evan
• Assistant Examiner(s): NORRIS, JEREMY C
• Application Number:
  US10/108,127
• Publication Number:
  US 20030183420A1
• Time in Patent Office: 931 Days
• Field of Search: 174/260, 174/262-266, 361/782, 361/783, 361/808, 361/832, 361/838, 361/842
• US Class Current: 174/260
• CPC Class Codes: H05K 1/113 Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 1/114 Pad being close to via, but not surrounding the via
• CPC Class Codes: H05K 2201/09709 Staggered pads, lands or terminals; Parallel conductors in different planes
• CPC Class Codes: H05K 2203/0455 PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
• CPC Class Codes: H05K 3/3421 Leaded components
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49147 Assembling terminal to base

Abstract

A circuit board apparatus and a method for a circuit board. An embodiment of a circuit board includes a first layer and a second layer; a substrate between the first layer and the second layer; a first surface mount device pad on the first layer of the substrate; a first via, the first via being formed partially or wholly through a first end of the first surface mount device pad, the first via passing through the substrate between the first layer and the second layer; a second surface mount device pad adjacent to the first surface mount device pad; and a second via, the second via being formed partially or wholly through a first end of the second surface mount device pad, the second via passing through the substrate, the first end of the first surface mount device pad being the end of the first surface mount device pad that is the farthest from the first end of the second surface mount device pad.

Claims

1. A circuit board comprising:

a first layer and a second layer;

a substrate between the first layer and the second layer;

a first surface mount device pad on the first layer of the substrate, the first surface mount device pad having a first end and a second end;

a first via, the first via being formed partially or wholly through the first end of the first surface mount device pad, the first via passing through the substrate between the first layer and the second layer;

a second surface mount device pad adjacent to the first surface mount device pad, the second surface mount device pad having a first end and a second end, the first end of the first surface mount device pad being adjacent to the first end of the second surface mount device pad and the second end of the first surface mount device pad being adjacent to the second end of the second surface mount device pad; and

a second via, the second via being formed partially or wholly through the second end of the second surface mount device pad, the second via passing through the substrate.

2. The circuit board of claim 1, wherein the first via electrically connects the first surface mount device pad to one or more layers of the circuit board.

3. The circuit board of claim 2, wherein a signal is transmitted between the first surface mount device pad and one or more layers of the circuit board through the first via.

4. The circuit board of claim 1, further comprising a surface mount device installed on the first layer of the substrate, a first lead of the surface mount device being connected to the first surface mount device pad and a second lead of the surface mount device being connected to the second surface mount device pad.

5. A circuit board comprising:

a first layer and a second layer, the first layer including a first pad and a second pad for installation of an electronic component to the first layer, the first pad and the second pad being adjacent to each other, the first pad and the second pad each having a first end and a second end, the first end of the first pad being adjacent to the first end of the second pad and the second end of the first pad being adjacent to the second end of the second pad;

a first via in the first pad, the first via being formed in the first end of the first pad, the first via passing partially or wholly through the first pad and passing through the circuit board between the first layer and the second layer; and

a second via in the second pad, the second via passing partially or wholly through the second pad, the second via being formed in the second end of the second pad.

6. The circuit board of claim 5, wherein the first via electrically connects the first pad to the second layer.

7. The circuit board of claim 6, wherein a signal is transmitted between the first pad and the second layer using the first via.

8. The circuit board of claim 5, further comprising an electronic component coupled to the first layer, the component including a first lead and a second lead, the first lead being coupled to the first pad and the second lead being coupled to the second pad.

9. A method comprising:

creating a first surface mount device contact and a second surface mount device contact as a part of a first layer of a circuit board, the first surface mount device contact and the second surface mount contact device being adjacent to each other, the first surface mount device contact and the second surface mount device contact each having a first end and a second end, the first end of the first surface mount device contact being adjacent to the first end of the second surface mount device contact, and the second end of the first surface mount device contact being adjacent to the second end of the second surface mount device contact;

forming a first via wholly or partially through the first surface mount device contact, the first via electrically connecting the first surface mount device contact to a second layer of the circuit board, the first via being formed in the first end of the first surface mount device contact; and

forming a second via wholly or partially through the second surface mount contact device, the second via being formed in the second end of the second surface mount device contact.

10. The method of claim 9, further comprising installing a surface mount device on the first layer of the circuit board, a first lead of the surface mount device being connected to the first surface mount device contact and a second lead of the surface mount device being connected to the second surface mount device contact.

11. The method of claim 9, wherein the first via provides a path for a signal between the first layer and the second layer.

12. A circuit board produced by a process comprising:

creating a first surface mount device contact as a part of a first layer on a surface of a substrate, the first surface mount device contact having a first end and a second end;

forming a first via wholly or partially through the first end of the first surface mount device contact, the first via electrically connecting the first surface mount device contact to a second layer;

creating a second surface mount device contact as a part of the first layer, the second surface device contact being adjacent to the first surface mount device contact, the second surface mount device contact having a first end and a second end, the first end of the first surface mount device contact being adjacent to the first end of the second surface mount device contact and the second end of the first surface mount device contact being adjacent to the second end of the second surface mount device contact; and

forming a second via wholly or partially through the second end of the second surface mount device contact.

13. The circuit board of claim 12, the process further comprising installing a surface mount device on the first layer, a first lead of the surface mount device being connected to the first surface mount device contact and a second lead of the surface mount device being connected to the second surface mount device contact.

14. The circuit board of claim 12, wherein the first via provides a path for a signal between the first layer and the second layer.