Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
First Claim
1. A substrate having penetrating holes formed therein, the substrate having a wiring pattern directly formed over a particular region including the penetrating holes on one side thereof, the substrate having protrusions formed in the internal wall surfaces of the penetrating holes by the material constituting the substrate.
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Accused Products
Abstract
The semiconductor device comprises an insulating film in which penetrating holes are formed, a semiconductor chip having electrodes, a wiring pattern adhered by an adhesive over a region including penetrating holes on one side of the insulating film and electrically connected to the electrodes of the semiconductor chip, and external electrodes provided on the wiring pattern through the penetrating holes and projecting from the surface opposite to the surface of the substrate on which the wiring pattern is formed. Part of the adhesive is drawn in to be interposed between the penetrating holes and external electrodes.
22 Citations
21 Claims
- 1. A substrate having penetrating holes formed therein, the substrate having a wiring pattern directly formed over a particular region including the penetrating holes on one side thereof, the substrate having protrusions formed in the internal wall surfaces of the penetrating holes by the material constituting the substrate.
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7. A method of manufacturing a substrate comprising:
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providing a substrate with an adhesive material provided on one surface thereof;
carrying out punching from the side of the substrate on which the adhesive material is provided and in the direction of the opposite side thereof to form penetrating holes and to draw a part of the adhesive material into the penetrating holes; and
adhering a wiring pattern over a particular region on the one surface including the penetrating holes on the substrate through the adhesive material. - View Dependent Claims (8, 9)
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- 10. A method of manufacturing a substrate comprising providing a substrate of a material of a higher elasticity than external electrodes, having penetrating holes in which the internal wall surfaces have protrusions, and having a wiring pattern directly formed over a region including the penetrating holes.
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15. A substrate comprising:
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a first side;
a second side opposite the first side;
penetrating holes extending through the substrate from the first side to the second side;
a wiring pattern adhered to the second side of the substrate by an adhesive material over a particular region of the second side, the wiring pattern formed over the penetrating holes, a part of the adhesive material formed on internal wall surfaces forming the penetrating holes so as not to stop up the penetrating holes; and
external electrodes contacting the wiring pattern and projecting through the penetrating holes from the second side of the substrate and extending beyond the first side of the substrate. - View Dependent Claims (16, 17, 18, 19, 20, 21)
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Specification