ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF MOUNTING THE CONTACT STRUCTURES TO ELECTRONIC COMPONENTS, AND APPLICATIONS FOR EMPLOYING THE CONTACT STRUCTURES
First Claim
Patent Images
1. Electrical connection between two electronic components, comprising:
- a conductive path consisting essentially of a metallic coating having at least one electrically-conductive layer, said metallic coating disposed on an elongate member, said coating extending between and interconnecting two electronic components, wherein said elongate member comprises a first material, and said metallic coating comprises a second material that is more resilient than said first material, wherein the coating is a plating having at least one layer, and the plating is a material selected from the group comprising copper, cobalt, iron, nickel, and their alloys.
1 Assignment
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Accused Products
Abstract
Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics.
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Citations
5 Claims
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1. Electrical connection between two electronic components, comprising:
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a conductive path consisting essentially of a metallic coating having at least one electrically-conductive layer, said metallic coating disposed on an elongate member, said coating extending between and interconnecting two electronic components, wherein said elongate member comprises a first material, and said metallic coating comprises a second material that is more resilient than said first material, wherein the coating is a plating having at least one layer, and the plating is a material selected from the group comprising copper, cobalt, iron, nickel, and their alloys. - View Dependent Claims (2, 3, 4, 5)
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2. Electrical connection, according to claim 1, wherein:
the elongate member is a wire.
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3. Electrical connection, according to claim 2, wherein:
the wire is electrically conductive.
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4. Electrical connection, according to claim 2, wherein:
the wire is a selected from a group comprising gold and its alloys.
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5. Electrical connection, according to claim 2, wherein:
the wire is a selected from a group comprising aluminum, copper, metals of the platinum group, lead, tin, indium, and their alloys.
Specification
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Current AssigneeFormFactor Incorporated
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Original AssigneeFormFactor Incorporated
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InventorsMathieu, Gaetan L., Eldridge, Benjamin N., Grube, Gary W., Khandros, Igor Y.
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Primary Examiner(s)Cuneo, Kamand
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Assistant Examiner(s)NORRIS, JEREMY C
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Application NumberUS09/746,960Publication NumberTime in Patent Office1,468 DaysField of Search174/267, 361/772-776, 257/734-737US Class Current174/267CPC Class CodesB23K 20/004 Wire weldingB23K 2101/40 Semiconductor devicesC23C 18/31 Coating with metalsC23C 18/32 Coating with nickel, cobalt...C23C 18/38 Coating with copperC25D 21/02 Heating or coolingC25D 5/12 at least one layer being of...C25D 5/16 Electroplating with layers ...C25D 5/605 Surface topography of the l...C25D 7/0607 WiresG01R 1/0483 Sockets for un-leaded IC's ...G01R 1/06711 Probe needles; Cantilever b...G01R 1/07314 the body of the probe being...G01R 1/07342 the body of the probe being...G01R 1/07357 with flexible bodies, e.g. ...G01R 1/07378 using an intermediate adapt...G01R 31/2884 using dedicated test connec...G01R 31/2886 Features relating to contac...H01L 21/4853 Connection or disconnection...H01L 21/4889 Connection or disconnection...H01L 21/563 : Encapsulation of active fac...H01L 21/6715 : Apparatus for applying a li...H01L 21/67248 : Temperature monitoringH01L 21/67253 : Process monitoring, e.g. fl...H01L 21/67288 : Monitoring of warpage, curv...H01L 22/20 : Sequence of activities cons...H01L 2224/05568 : the whole external layer pr...H01L 2224/05571 : the external layer being di...H01L 2224/05572 : the external layer extendin...H01L 2224/05573 : Single external layerH01L 2224/1134 : Stud bumping, i.e. using a ...H01L 2224/13082 : Two-layer arrangementsH01L 2224/13099 : MaterialH01L 2224/13124 : Aluminium [Al] as principal...H01L 2224/13144 : Gold [Au] as principal cons...H01L 2224/13147 : Copper [Cu] as principal co...H01L 2224/13647 : Copper [Cu] as principal co...H01L 2224/13655 : Nickel [Ni] as principal co...H01L 2224/16145 : the bodies being stackedH01L 2224/45014 : Ribbon connectors, e.g. rec...H01L 2224/45015 : being circularH01L 2224/45109 : Indium (In) as principal co...H01L 2224/45111 : Tin (Sn) as principal const...H01L 2224/45116 : Lead (Pb) as principal cons...H01L 2224/4512 : Antimony (Sb) as principal ...H01L 2224/45123 : Magnesium (Mg) as principal...H01L 2224/45124 : Aluminium (Al) as principal...H01L 2224/45138 : the principal constituent m...H01L 2224/45139 : Silver (Ag) as principal co...H01L 2224/45144 : Gold (Au) as principal cons...H01L 2224/45147 : Copper (Cu) as principal co...H01L 2224/45155 : Nickel (Ni) as principal co...H01L 2224/45163 : the principal constituent m...H01L 2224/45164 : Palladium (Pd) as principal...H01L 2224/45169 : Platinum (Pt) as principal ...H01L 2224/45173 : Rhodium (Rh) as principal c...H01L 2224/45176 : Ruthenium (Ru) as principal...H01L 2224/45565 : Single coating layerH01L 2224/4569 : with a principal constituen...H01L 2224/48 : of an individual wire conne...H01L 2224/48091 : ArchedH01L 2224/48095 : KinkedH01L 2224/48227 : connecting the wire to a bo...H01L 2224/48599 : Principal constituent of th...H01L 2224/49109 : outside the semiconductor o...H01L 2224/73203 : Bump and layer connectorsH01L 2224/78301 : CapillaryH01L 2224/81801 : Soldering or alloyingH01L 2224/85043 : using a flame torch, e.g. h...H01L 2224/85045 : using a corona discharge, e...H01L 2224/851 : the connector being supplie...H01L 2224/85201 : Compression bondingH01L 2224/85203 : Thermocompression bondingH01L 2224/85205 : Ultrasonic bondingH01L 2225/0651 : Wire or wire-like electrica...H01L 2225/06527 : Special adaptation of elect...H01L 2225/06555 : Geometry of the stack, e.g....H01L 2225/06572 : Auxiliary carrier between d...H01L 23/49811 : Additional leads joined to ...H01L 24/11 : Manufacturing methods for b...H01L 24/13 : of an individual bump conne...H01L 24/16 : of an individual bump conne...H01L 24/45 : of an individual wire conne...H01L 24/48 : of an individual wire conne...H01L 24/49 : of a plurality of wire conn...H01L 24/72 : Detachable connecting means...H01L 24/78 : Apparatus for connecting wi...H01L 24/81 : using a bump connectorH01L 24/85 : using a wire connector wire...H01L 25/0652 : the devices being arranged ...H01L 25/16 : the devices being of types ...H01L 2924/00 : Indexing scheme for arrange...H01L 2924/00012 : Relevant to the scope of th...H01L 2924/00013 : Fully indexed contentH01L 2924/00014 : the subject-matter covered ...H01L 2924/00015 : the subject-matter covered ...H01L 2924/01004 : Beryllium [Be]H01L 2924/01005 : Boron [B]H01L 2924/01006 : Carbon [C]H01L 2924/01011 : Sodium [Na]H01L 2924/01012 : Magnesium [Mg]H01L 2924/01014 : Silicon [Si]H01L 2924/01015 : Phosphorus [P]H01L 2924/01018 : Argon [Ar]H01L 2924/01019 : Potassium [K]H01L 2924/01022 : Titanium [Ti]H01L 2924/01023 : Vanadium [V]H01L 2924/01027 : Cobalt [Co]H01L 2924/01028 : Nickel [Ni]H01L 2924/01029 : Copper [Cu]H01L 2924/0103 : Zinc [Zn]H01L 2924/01031 : Gallium [Ga]H01L 2924/01039 : Yttrium [Y]H01L 2924/01042 : Molybdenum [Mo]H01L 2924/01044 : Ruthenium [Ru]H01L 2924/01045 : Rhodium [Rh]H01L 2924/01047 : Silver [Ag]H01L 2924/01048 : Cadmium [Cd]H01L 2924/01049 : Indium [In]H01L 2924/0105 : Tin [Sn]H01L 2924/01051 : Antimony [Sb]H01L 2924/0106 : Neodymium [Nd]H01L 2924/01074 : Tungsten [W]H01L 2924/01075 : Rhenium [Re]H01L 2924/01076 : Osmium [Os]H01L 2924/01077 : Iridium [Ir]H01L 2924/01078 : Platinum [Pt]H01L 2924/01079 : Gold [Au]H01L 2924/01083 : Bismuth [Bi]H01L 2924/01204 : 4N purity grades, i.e. 99.99%H01L 2924/013 : AlloysH01L 2924/01322 : Eutectic Alloys, i.e. obtai...H01L 2924/014 : Solder alloysH01L 2924/07802 : not being an ohmic electric...H01L 2924/10253 : Silicon [Si]H01L 2924/10329 : Gallium arsenide [GaAs]H01L 2924/12041 : LEDH01L 2924/12042 : LASERH01L 2924/12044 : OLEDH01L 2924/14 : Integrated circuitsH01L 2924/15153 : the die mounting substrate ...H01L 2924/15165 : Monolayer substrateH01L 2924/15312 : being a pin array, e.g. PGAH01L 2924/1532 : the connection portion bein...H01L 2924/16195 : Flat cap [not enclosing an ...H01L 2924/181 : EncapsulationH01L 2924/19041 : being a capacitorH01L 2924/19043 : being a resistorH01L 2924/19107 : off-chip wiresH01L 2924/206 : Length rangesH01L 2924/2075 : larger or equal to 1 micron...H01L 2924/20751 : larger or equal to 10 micro...H01L 2924/20752 : larger or equal to 20 micro...H01L 2924/20753 : larger or equal to 30 micro...H01L 2924/20754 : larger or equal to 40 micro...H01L 2924/20755 : larger or equal to 50 micro...H01L 2924/20756 : larger or equal to 60 micro...H01L 2924/20757 : larger or equal to 70 micro...H01L 2924/30105 : CapacitanceH01L 2924/30107 : InductanceH01L 2924/3011 : ImpedanceH01L 2924/3025 : Electromagnetic shieldingH01R 12/52 : connecting to other rigid p...H05K 1/141 : One or more single auxiliar...H05K 2201/0397 : TabH05K 2201/068 : wherein the coefficient of ...H05K 2201/1031 : Surface mounted metallic co...H05K 2201/10318 : Surface mounted metallic pinsH05K 2201/10378 : InterposersH05K 2201/10719 : Land grid array [LGA]H05K 2201/10734 : Ball grid array [BGA]; Bump...H05K 2201/10757 : Bent leadsH05K 2201/10878 : Means for retention of a le...H05K 2201/10909 : Materials of terminal, e.g....H05K 2201/10946 : Leads attached onto leadles...H05K 3/20 : by affixing prefabricated c...H05K 3/308 : Adaptations of leads connec...H05K 3/326 : the printed circuit having ...H05K 3/3421 : Leaded componentsH05K 3/3426 : characterised by the leadsH05K 3/368 : parallel to each other H05K...H05K 3/4015 : using auxiliary conductive ...H05K 3/4092 : Integral conductive tabs, i...H05K 7/1069 : with spring contact piecesY02P 70/50 : Manufacturing or production...Y10T 29/49147 : Assembling terminal to baseY10T 29/49149 : by metal fusion bondingY10T 29/49174 : Assembling terminal to elon...Y10T 29/49204 : Contact or terminal manufac...Y10T 29/49208 : by assembling plural partsY10T 29/49213 : Metal