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Edge bead control method and apparatus

  • US 6,887,801 B2
  • Filed: 07/18/2003
  • Issued: 05/03/2005
  • Est. Priority Date: 07/18/2003
  • Status: Expired due to Fees
First Claim
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1. A method of preparing a wafer for a fabrication process, the method comprising:

  • providing a wafer receiving apparatus for receiving a wafer of a first size, the wafer receiving apparatus including a recessed portion having a depth;

    placing a wafer of the first size in the recessed portion of the wafer receiving apparatus;

    applying photoresist to the wafer;

    spinning the wafer and the wafer receiving apparatus while the wafer is placed in the recessed portion of the wafer receiving apparatus; and

    wherein the wafer receiving apparatus further includes a circumferential groove in the recessed portion, wherein the method further comprises;

    allowing a fluid to enter the circumferential groove; and

    causing the fluid in the circumferential groove to expand and release the wafer from the pocket.

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