Multi-layer wiring structure with dummy patterns for improving surface flatness
First Claim
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1. A multi-layer wiring structure comprising:
- a support substrate, on a surface of which a first area, a loop shape second area surrounding the first area, and a third area surrounding the second area are defined;
an upper wiring layer disposed above the support substrate, the upper wiring layer comprising an interlayer insulating film, recesses formed in the interlayer insulating film in the second area and the third area, a wiring filling the recess in the third area and dummy patterns filling the recess in the second area, and the upper wiring layer not comprising conductive patterns in the first area; and
a functional element disposed above the upper wiring layer and in the first area.
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Abstract
A first area, a ring shape second area surrounding the first area, and a third area surrounding the second area are defined on the surface of a support substrate. A first wiring layer is disposed above the support substrate. A wiring is formed in the third area, dummy patterns being formed in the second area, and conductive patterns are not formed in the first area. A functional element is disposed above the first wiring layer and in the first area.
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Citations
13 Claims
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1. A multi-layer wiring structure comprising:
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a support substrate, on a surface of which a first area, a loop shape second area surrounding the first area, and a third area surrounding the second area are defined; an upper wiring layer disposed above the support substrate, the upper wiring layer comprising an interlayer insulating film, recesses formed in the interlayer insulating film in the second area and the third area, a wiring filling the recess in the third area and dummy patterns filling the recess in the second area, and the upper wiring layer not comprising conductive patterns in the first area; and a functional element disposed above the upper wiring layer and in the first area. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A multi-layer wiring structure comprising:
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a support substrate having a loop shape first area, a third area surrounding the first area, and a fourth area surrounded by the first area, respectively defined on a surface of the support substrate; an upper wiring layer disposed above the support substrate, the upper wiring layer comprising an interlayer insulating film, recesses formed in the interlayer insulating film in the third area and the fourth area, a wiring filling the recess in the third area and dummy patterns filling the recess in the fourth area, and the upper wiring layer not comprising conductive patterns in the first area; and a functional element disposed above the upper wiring layer and in the first area. - View Dependent Claims (11, 12, 13)
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Specification