Multilayer wiring board including stacked via structure
First Claim
Patent Images
1. A multilayer wiring board comprising:
- a substrate having a first main surface and a second main surface;
a first planar conductor layer disposed, directly or indirectly, on at least one of the first main surface and the second main surface;
a second planar conductor layer disposed in spaced relation to the first planar conductor layer;
a plurality of resin dielectric layers interposed between the first planar conductor layer and the second planar conductor layer;
filled vias formed in the resin dielectric layers; and
a stacked via structure disposed in the resin dielectric layers and comprising a plurality of the filled vias stacked substantially coaxially and mutually connected together;
the stacked via structure having a first end and a second end;
the first end being directly connected to either the first planar conductor layer or the second planar conductor layer; and
the second end being connected to the first planar conductor layer or, to the second planar conductor layer by a conformal via less than completely filled with conductor material including a side wall portion and a connector portion bridging the side wall portion at said second end of the stacked via structure, said side wall portion and said connector portion being of a common uniform thickness and said connector portion being connected to the first planar conductor layer or the second planar conductor layer.
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Accused Products
Abstract
A multilayer wiring board includes a substrate, a first planar conductor layer, a second planar conductor layer, resin dielectric layers, filled vias, and stacked via structures. Each of the stacked via structures is disposed in the resin dielectric layers and is configured such that the filled vias are stacked substantially coaxially and are mutually connected together. A first end of the stacked via structure is connected directly to either the first planar conductor layer or the second planar conductor layer. A second end of the stacked via structure is unconnected, directly, to both the first planar conductor layer and the second planar conductor layer.
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Citations
3 Claims
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1. A multilayer wiring board comprising:
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a substrate having a first main surface and a second main surface; a first planar conductor layer disposed, directly or indirectly, on at least one of the first main surface and the second main surface; a second planar conductor layer disposed in spaced relation to the first planar conductor layer; a plurality of resin dielectric layers interposed between the first planar conductor layer and the second planar conductor layer; filled vias formed in the resin dielectric layers; and a stacked via structure disposed in the resin dielectric layers and comprising a plurality of the filled vias stacked substantially coaxially and mutually connected together; the stacked via structure having a first end and a second end;
the first end being directly connected to either the first planar conductor layer or the second planar conductor layer; and
the second end being connected to the first planar conductor layer or, to the second planar conductor layer by a conformal via less than completely filled with conductor material including a side wall portion and a connector portion bridging the side wall portion at said second end of the stacked via structure, said side wall portion and said connector portion being of a common uniform thickness and said connector portion being connected to the first planar conductor layer or the second planar conductor layer.
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2. A multilayer wiring board comprising:
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a substrate having a first main surface and a second main surface; a first planar conductor layer disposed, directly or indirectly, on at least one of the first main surface and the second main surface; a second planar conductor layer disposed in spaced relation to the first planar conductor layer; resin dielectric layers interposed between the first planar conductor layer and the second planar conductor layer; filled vias formed in the resin dielectric layers; and a stacked via structure disposed in the resin dielectric layers and comprising a plurality of the filled vias stacked substantially coaxially and mutually connected together; the stacked via structure having a first end and a second end;
the first end being connected directly to the second planar conductor layer; and
the second end being connected to the first planar conductor layer by a conformal via comprising a conductor member having a recess therein filled by resin of one of said resin dielectric layers, said conductor member including a side wall portion and a connector portion bridging the side wall portion at said second end of the stacked via structure, said side wall portion and said connector portion being of a common uniform thickness and said connector portion being connected to the first planar conductor layer or the second planar conductor layer.
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3. A multilayer wiring board comprising:
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a substrate having a first main surface and a second main surface; a first planar conductor layer disposed, directly or indirectly, on at least one of the first main surface and the second main surface; a second planar conductor layer disposed in spaced relation to the first planar conductor layer; resin dielectric layers interposed between the first planar conductor layer and the second planar conductor layer; filled vias formed in the resin dielectric layers; a stacked via structure disposed in the resin dielectric layers and comprising a plurality of the filled vias stacked substantially coaxially and mutually connected together; and a conformal via formed in one of the resin dielectric layers and having a land portion smaller in area than the first and second planar conductor layers, said conformal via being less than completely filled with conductor material; the stacked via structure having a first end and a second end;
the first end being connected directly to the second planar conductor layer;
the second end being connected directly to the land portion of the conformal via; and
a bottom surface of the conformal via being connected directly to the first planar conductor layer and said conductor member including a side wall portion and a connector portion bridging the side wall portion at said second end of the stacked via structure, said side wall portion and said connector portion being of a common uniform thickness and said connector portion being connected to the first planar conductor layer or the second planar conductor layer.
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Specification