Placement tool for wafer scale caps
First Claim
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1. A tool used to hold an array of wafer scale protective caps and place the array onto a semiconductor wafer, the tool comprising:
- a first tool half made from a semiconductor that has a coefficient of thermal expansion which is about the same as that of the wafer, the first tool half having surface features which have a converse shape to a part of a shape of the caps, the surface features being configured to mold the caps to have said part of said shape; and
a second tool half having an upper surface in which grooves are formed, the surface features of the first tool half and the grooves cooperating so as to define mold cavities for the caps.wherein the converse shape of the surface features is configured to retain the array of molded caps for placement onto the wafer.
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Abstract
A tool is used to hold an array of wafer scale protective caps and place the array onto a semiconductor wafer. The tool comprises a first tool half made from a semiconductor which has a coefficient of thermal expansion which is about the same as that of the wafer. The first tool half has surface features for molding and retaining the array. The caps have central areas surrounded by sidewalls.
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Citations
18 Claims
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1. A tool used to hold an array of wafer scale protective caps and place the array onto a semiconductor wafer, the tool comprising:
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a first tool half made from a semiconductor that has a coefficient of thermal expansion which is about the same as that of the wafer, the first tool half having surface features which have a converse shape to a part of a shape of the caps, the surface features being configured to mold the caps to have said part of said shape; and a second tool half having an upper surface in which grooves are formed, the surface features of the first tool half and the grooves cooperating so as to define mold cavities for the caps. wherein the converse shape of the surface features is configured to retain the array of molded caps for placement onto the wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification