Method of producing a wireless communication device

• US 7,191,507 B2
• Filed: 04/24/2003
• Issued: 03/20/2007
• Est. Priority Date: 04/24/2002
• Status: Active Grant

• Current Assignee: Mineral Lassen LLC (Intellectual Ventures LLC)
• Original Assignee: Mineral Lassen LLC (Intellectual Ventures LLC)
• Inventors: Forster, Ian J., King, Patrick F.
• Primary Examiner(s): Tugbang; A. Dexter
• Assistant Examiner(s): NGUYEN, TAI V
• Application Number:
  US10/422,616
• Publication Number:
  US 20040078957A1
• Time in Patent Office: 1,426 Days
• Field of Search: 296/00, 296/01, 298/31, 298/32, 298/40, 295/93, 343/676, 343/873, 343/700.R, 343/767, 340/572.8, 340/568.1, 340/539
• US Class Current: 29/600
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01Q 9/285 Planar dipole H01Q9/065 takes precedence; patch antenna H01Q9/0407
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 3/041 by using a die for cutting the conductive material
• CPC Class Codes: H05K 3/326 the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: Y10T 156/1075 of plural laminae from single stock and assembling to each other or to additional lamina
• CPC Class Codes: Y10T 156/1097 Lamina is running length web
• CPC Class Codes: Y10T 29/49 Method of mechanical manufacture
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49751 : Scrap recovering or utilizing
• CPC Class Codes: Y10T 29/49755 : Separating one material from another
• CPC Class Codes: Y10T 29/5137 : including assembling or disassembling station
• CPC Class Codes: Y10T 29/5139 : and means to sever work prior to disassembling
• CPC Class Codes: Y10T 29/514 : comprising means to strip insulation from wire
• CPC Class Codes: Y10T 29/5313 : Means to assemble electrical device
• CPC Class Codes: Y10T 29/53165 : Magnetic memory device
• CPC Class Codes: Y10T 29/5317 : Laminated device
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53178 : Chip component
• CPC Class Codes: Y10T 29/532 : Conductor
• CPC Class Codes: Y10T 29/53265 : with work-holder for assembly
• CPC Class Codes: Y10T 83/7868 : Tool element selectively operative

Abstract

A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless communication device. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each on effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.

Claims

1. A method of producing a wireless communication device, comprising:

adjustably cutting a first tab for use as a first antenna element;

adjustably cutting a second tab for use as a second antenna element; and

securing said first and second tabs to a wireless communication chip, thereby forming a wireless communication device,

wherein the first and second tabs are adjustably cut according to a determined electrical characteristic.

2. The method of claim 1, further comprising creating a cavity in a substrate.

3. The method of claim 2, further comprising inserting said wireless communication chip into said cavity such that said wireless communication chip is flush with an upper level of said substrate.

4. The method of claim 2, further comprising inserting said wireless communication chip into said cavity such that said wireless communication chip is wholly placed inside said cavity.

5. The method of claim 2, further comprising inserting said wireless communication chip into said cavity such that said wireless communication chip is partially placed inside said cavity.

6. The method of claim 2, further comprising inserting said wireless communication chip into said cavity such that said wireless communication chip is placed below an upper surface of said cavity.

7. The method of claim 2, further comprising creating said cavity with tapered edges at an upper surface of said substrate that taper from a wide opening to a narrow mouth.

8. The method of claim 7, further comprising sizing said narrow mouth relative to said wireless communication chip so that, when inserted into said cavity, said wireless communication chip rests in said cavity at the point where said narrow mouth begins.

9. The method of claim 2, wherein said first and second tabs are adjustably cut before said cavity is created.

10. The method of claim 2, wherein said first and second tabs are adjustably cut concurrently with creation of said cavity.

11. The method of claim 2, wherein said first and second tabs are adjustably cut after said cavity is created.

12. The method of claim 1, wherein securing said first and second tabs to a wireless communication chip comprises adhering with a conductive adhesive said first and second tabs to the wireless communication chip.

13. The method of claim 12, further comprising applying said conductive adhesive to ends of said first and second tabs prior to securing said first and second tabs to said wireless communication chip.

14. The method of claim 12, further comprising applying a pressure sensitive conductive adhesive to a top surface of the first and second tabs and pushing said wireless communication chip onto said pressure sensitive conductive adhesive.

15. The method of claim 12, further comprising curing said conductive adhesive to secure said first and second tabs to said wireless communication chip.

16. The method of claim 15, wherein said conductive adhesive is cured by ultraviolet light.

17. The method of claim 1, wherein securing said first and second tabs to a wireless communication chip comprises welding said first and second tabs to the wireless communication chip.

18. The method of claim 1, wherein securing said first and second tabs to a wireless communication chip, further comprises:

creating fingers on said first and second tabs;

heating pins on the wireless communication chip; and

inserting said heated pins into a substrate such that the fingers on said first and second tabs wrap around said pins and a mechanical bond is formed around said pins.

19. The method of claim 1, wherein securing said first and second tabs to a wireless communication chip comprises soldering the wireless communication chip to the first and second tabs.

20. The method of claim 19, wherein soldering the wireless communication chip to the first and second tabs comprises applying a soldering paste to said first and second tabs.

21. The method of claim 20, wherein soldering the wireless communication chip to the first and second tabs further comprises using infrared radiation to heat the soldering paste.

22. The method of claim 20, further comprising heating pins on said wireless communication chip and inserting said heated pins into said soldering paste.

23. The method of claim 1, wherein said electrical characteristic is capacitance.

24. The method of claim 23, wherein said electrical characteristic is determined by assessing the capacitance of said first and second tabs in conjunction with a substrate on which the tabs are deposited.

25. The method of claim 23, wherein said first and second tabs are adjustably cut to obtain a desired capacitance.

26. The method of claim 1, wherein said electrical characteristic is impedance.

27. The method of claim 26, wherein said first and second tabs are adjustably cut to obtain a desired impedance.

28. The method of claim 27, wherein said desired impedance is an impedance of said first and second antenna elements and said desired impedance matches an impedance of said wireless communication chip.

29. The method of claim 1, wherein said electrical characteristic is determined on the fly while producing said wireless communication device.

30. The method of claim 1, wherein said cutting of said first and second tabs is automatically adjusted subsequent to determining said electrical characteristic.

31. The method of claim 1, wherein securing said first and second tabs to a wireless communication chip comprises tacking said first and second tabs to the wireless communication chip.

32. The method of claim 1, wherein securing said first and second tabs to a wireless communication chip comprises passing a current through a metal foil connected to the wireless communication chip that melts the foils and adheres to said first and second tabs.

33. The method of claim 1, further comprising placing a layer over said wireless communication chip to hold said chip firmly in its desired location.

34. The method of claim 33, wherein the layer is a sealing layer.

35. The method of claim 33, wherein the layer comprises a material suitable for printing.

36. A method of producing a wireless communication device, comprising:

adjustably cutting a first tab for use as a first antenna element;

adjustably cutting a second tab for use as a second antenna element; and

securing said first and second tabs to a wireless communication chip, thereby forming a wireless communication device,

wherein adjustably cutting a first tab for use as a first antenna element comprises using a plurality of selectively phaseable rollers to cut said first tab.

37. A method of producing a wireless communication device, comprising:

adjustably cutting a first tab for use as a first antenna element;

adjustably cutting a second tab for use as a second antenna element; and

securing said first and second tabs to a wireless communication chip, thereby forming a wireless communication device,

wherein adjustably cutting a first tab for use as a first antenna element comprises varying a position associated with a cutting roller with respect to a center point so as to increase or decrease the length of the tab.

38. A method of producing a wireless communication device, comprising:

adjustably cutting a first tab for use as a first antenna element;

adjustably cutting a second tab for use as a second antenna element; and

securing said first and second tabs to a wireless communication chip, thereby forming a wireless communication device,

wherein adjustably cutting a second tab for use as a second antenna element comprises using a plurality of selectively phaseable rollers to cut said second tab.

39. A method of producing a wireless communication device, comprising:

adjustably cutting a first tab for use as a first antenna element;

adjustably cutting a second tab for use as a second antenna element; and

securing the first and second tabs to a wireless communication chip, thereby forming a wireless communication device,

wherein adjustably cutting the first and second tabs comprises;

passing a conductive foil having a backing material through a first roller to generate a first cut;

passing the conductive foil having the backing material through a second roller to generate a second cut thereby forming the first antenna element; and

passing the conductive foil having a backing material through a third roller to generate a third cut thereby forming the second antenna element.

40. The method of claim 39, further comprising separating waste material from said backing material.

41. The method of claim 39, further comprising varying the relative phases of the rollers to vary the size of the first and second antenna elements.

42. The method of claim 41, wherein varying the relative phases of the rollers comprises varying the phase of the second roller with respect to the first roller to vary the size of the first antenna element.

43. The method of claim 41, wherein varying the relative phases of the rollers comprises varying the phase of the third roller with respect to the first roller to vary the size of the second antenna element.

44. The method of claim 39, wherein the cut formed by the second roller overlaps the cut formed by the first roller.

45. The method of claim 39, wherein the cut formed by the third roller overlaps the cut formed by the first roller.

46. The method of claim 39, wherein the cut formed by the first roller comprises portions of cuts required to form the, first and second antenna elements.

47. A method of producing a wireless communication device, comprising:

adjustably cutting a first tab for use as a first antenna element;

adjustably cutting a second tab for use as a second antenna element; and

securing said first and second tabs to a wireless communication chip, thereby forming a wireless communication device,

wherein adjustably cutting the first and second tabs comprises;

passing a tape having a plurality of tabs disposed thereon under a first roller and a second roller;

testing capacitance formed by said tabs;

varying the spacing between the first and second rollers; and

cutting two of the tabs to form the first and second antenna elements.

48. The method of claim 47, wherein at least two of the tabs are differently sized.

49. The method of claim 47, wherein cutting two of the tabs to form the first and second antenna elements further comprises cutting a backing material.

50. The method of claim 49, further comprising adhering said backing material to a substrate.

51. The method of claim 47, further comprising positioning said tape proximate a substrate prior to the step of testing capacitance.