Wirebond crack sensor for low-k die
First Claim
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1. A sensor structure for measuring damage encountered by a semiconductor device, wherein said sensor structure comprises:
- at least one wirebond sensor, said at least one wirebond sensor comprising a BEOL wiring arrangement, including circuitry for determining damage in a low-k die, wafer or pad, said circuitry wirebonding serpentine and comb-like wiring in a dielectric substrate, said BEOL wiring arrangement comprising an array of serpentine and comb-like wiring located at minimum spacings so as to check for continuity in the wiring circuits of semiconductor devices employing chips formed from said die, wafer or pad, and for detecting leakage current indicative of damaged dielectric components.
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Abstract
A sensor for measuring cracks in a semiconductor device, such as a wafer and, more particularly, to a BEOL wirebond crack sensor for low-k dies or wafers, and a method of providing the wirebond crack sensor for low-k wafers or the like structures.
47 Citations
14 Claims
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1. A sensor structure for measuring damage encountered by a semiconductor device, wherein said sensor structure comprises:
at least one wirebond sensor, said at least one wirebond sensor comprising a BEOL wiring arrangement, including circuitry for determining damage in a low-k die, wafer or pad, said circuitry wirebonding serpentine and comb-like wiring in a dielectric substrate, said BEOL wiring arrangement comprising an array of serpentine and comb-like wiring located at minimum spacings so as to check for continuity in the wiring circuits of semiconductor devices employing chips formed from said die, wafer or pad, and for detecting leakage current indicative of damaged dielectric components. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of providing a sensor structure for measuring damage encountered by a semiconductor device, wherein said method comprises:
providing at least one wirebond sensor, said at least one wirebond sensor comprising a BEOL wiring arrangement, including circuitry for determining damage in a low-k die, wafer or pad, said circuitry wirebonding serpentine and comb-like wiring in a dielectric substrate, and said BEOL wiring arrangement comprising an array of serpentine and comb-like wiring located at minimum spacings so as to check for continuity in the wiring circuits of semiconductor devices employing chips formed from said die, wafer or pad, and for detecting leakage current indicative of damaged dielectric components. - View Dependent Claims (9, 10, 11, 12, 13, 14)
Specification