Interferometric modulators with thin film transistors
First Claim
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1. A modulator, comprising:
- a transparent substrate having a first surface;
an array of a plurality of interferometric modulator elements on the first surface; and
at least one thin film semiconductor circuit component electrically connected to at least one of the interferometric modulator elements and integrated within the array, wherein the thin film semiconductor circuit component is located on the first surface of the substrate.
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Abstract
A modulator has a transparent substrate with a first surface. At least one interferometric modulator element resides on the first surface. At least one thin film circuit component electrically connected to the element resides on the surface. When more than one interferometric element resides on the first surface, there is at least one thin film circuit component corresponding to each element residing on the first surface.
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Citations
12 Claims
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1. A modulator, comprising:
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a transparent substrate having a first surface; an array of a plurality of interferometric modulator elements on the first surface; and at least one thin film semiconductor circuit component electrically connected to at least one of the interferometric modulator elements and integrated within the array, wherein the thin film semiconductor circuit component is located on the first surface of the substrate. - View Dependent Claims (2, 3, 4)
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5. A method of manufacturing an interferometric modulator with thin film transistors, the method comprising:
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providing a transparent substrate; manufacturing an interferometric modulator array on a first surface of the transparent substrate; and manufacturing thin film circuit components on the first surface of the transparent substrate and integrated within the array. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12)
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Specification