Method and system for sealing a substrate
First Claim
Patent Images
1. An electronic device, comprising:
- a substrate;
a MEMS device on the substrate;
a metal seal, wherein the metal seal is positioned on the substrate proximate a perimeter of the MEMS device, thereby forming an hermetic seal proximate a perimeter of the MEMS device; and
means for sealing said MEMS device in contact with the metal seal, thereby encapsulating the MEMS device within the substrate, the metal seal, and the means for sealing.
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Abstract
A method of sealing a microelectromechanical system (MEMS) device from ambient conditions is described, wherein the MEMS device is formed on a substrate and a substantially hermetic seal is formed as part of the MEMS device manufacturing process. The method comprises forming a metal seal on the substrate proximate a perimeter of the MEMS device using a method such as photolithography. The metal seal is formed on the substrate while the MEMS device retains a sacrificial layer between conductive members of MEMS elements, and the sacrificial layer is removed after formation of the seal and prior to attachment of a backplane.
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Citations
23 Claims
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1. An electronic device, comprising:
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a substrate; a MEMS device on the substrate; a metal seal, wherein the metal seal is positioned on the substrate proximate a perimeter of the MEMS device, thereby forming an hermetic seal proximate a perimeter of the MEMS device; and means for sealing said MEMS device in contact with the metal seal, thereby encapsulating the MEMS device within the substrate, the metal seal, and the means for sealing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A microelectromechanical system (MEMS) device sealed from ambient conditions, comprising:
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a MEMS device formed on a substrate; a substantially metal seal formed on the substrate proximate a perimeter of the MEMS device, wherein the metal seal comprises a metal seed layer or an adhesion layer; and a backplane in contact with the substantially metal seal, thereby encapsulating the MEMS device within the substrate, the substantially metal seal, and the backplane. - View Dependent Claims (13, 14, 15, 23)
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16. An electronic device, comprising:
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a MEMS device formed on a substrate; a seal comprising metal, wherein said seal is formed on the substrate proximate a perimeter of the MEMS device, thereby forming an hermetic seal proximate a perimeter of the MEMS device; and a back-plate in contact with the seal, thereby encapsulating the MEMS device within the substrate, the seal, and the back-plate. - View Dependent Claims (17, 18, 19, 20, 21, 22)
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Specification