Methods for fabricating fuse programmable three dimensional integrated circuits
First Claim
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1. A method of fabricating a field programmable integrated circuit comprised of:
- constructing a semiconductor device comprising a fuse circuit to customize the logic content of a programmable logic circuit; and
attaching said semiconductor device in a detachable lid package, wherein the fuses are customized in the field by detaching the lid and blowing one or more fuse elements.
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Abstract
A method of fabricating a field programmable integrated circuit comprised of: constructing a semiconductor device comprising a fuse circuit to customize the logic content of a programmable logic circuit; and attaching said semiconductor device in a detachable lid package, wherein the fuses are customized in the field by detaching the lid and blowing one or more fuse elements. The said method further comprised of: providing a custom hard-wire pattern in lieu of the fuse circuit, wherein the programmable logic circuit timing is identical between the fuse circuit and hard-wire options.
281 Citations
20 Claims
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1. A method of fabricating a field programmable integrated circuit comprised of:
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constructing a semiconductor device comprising a fuse circuit to customize the logic content of a programmable logic circuit; and attaching said semiconductor device in a detachable lid package, wherein the fuses are customized in the field by detaching the lid and blowing one or more fuse elements. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of forming a programmable semiconductor device comprised of:
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fabricating digital circuits comprising a programmable logic circuit on a substrate; fabricating an interconnect and routing structure substantially above the digital circuits; and fabricating a programmable fuse circuit above the routing structure to program said programmable logic circuit, wherein the fuse circuit is programmed to store binary data values. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method of fabricating a programmable integrated circuit comprised of:
fabricating a packaged semiconductor device comprising only a laser fuse circuit as the top most metal layer to customize the logic content of a programmable logic circuit. - View Dependent Claims (19, 20)
Specification