Sensor substrate and method of fabricating same
First Claim
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1. A sensing apparatus comprising:
- a substrate composed of alumina and having a first side for a sensing element and a second side for electronics;
a via comprising a linear hollow path formed from the first side of the substrate to the second side of the substrate and filled with an electrically conductive material for making electrical contact from the first side of the substrate to the second side of the substrate; and
a cap covering the via;
wherein the via is hermetically sealed from the first side of the substrate to the second side of the substrate; and
wherein the cap is made from alumina.
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Abstract
A substrate with hermetically sealed vias extending from one side of the substrate to another and a method for fabricating same. The vias may be filled with a conductive material such as, for example, a fritless ink. The conductive path formed by the conductive material aids in sealing one side of the substrate from another. One side of the substrate may include a sensing element and another side of the substrate may include sensing electronics.
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Citations
25 Claims
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1. A sensing apparatus comprising:
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a substrate composed of alumina and having a first side for a sensing element and a second side for electronics; a via comprising a linear hollow path formed from the first side of the substrate to the second side of the substrate and filled with an electrically conductive material for making electrical contact from the first side of the substrate to the second side of the substrate; and a cap covering the via; wherein the via is hermetically sealed from the first side of the substrate to the second side of the substrate; and wherein the cap is made from alumina. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 20, 22, 24)
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12. A sensing apparatus comprising:
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a substrate composed of alumina and having a first side and a second side; a sensor for sensing a biological condition and providing an electrical signals dependent upon the sensed biological condition, the sensor disposed on the first side of the substrate; electronics for processing electrical signals provided by the sensor, the electronics disposed on the second side of the substrate; at least one via, each via comprising a linear hollow path formed from the first side of the substrate to the second side of the substrate and filled with an electrically conductive material for making electrical contact from the first side of the substrate to the second side of the substrate, wherein the via is hermetically sealed from the first side of the substrate to the second side of the substrate. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 21, 23, 25)
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Specification