Lead-free glass material for use in sealing and, sealed article and method for sealing using the same

• US 7,425,518 B2
• Filed: 06/21/2005
• Issued: 09/16/2008
• Est. Priority Date: 02/19/2003
• Status: Expired due to Term

• Current Assignee: Yamato Electronic Co., Ltd.
• Original Assignee: Yamato Electronic Co., Ltd.
• Inventors: Yoshida, Masahiro, Honda, Tomoyuki, Hatate, Yasuo, Sarata, Tsugumitsu, Uemura, Yoshimitsu, Iwashita, Masahiro, Fukunaga, Hiroyuki
• Primary Examiner(s): Green; Anthony J
• Application Number:
  US11/158,258
• Publication Number:
  US 20050233885A1
• Time in Patent Office: 1,183 Days
• Field of Search: 501/15, 501/17, 501/21, 501/26, 501/32
• US Class Current: 501/15
• CPC Class Codes: C03C 27/044 of glass, glass-ceramic or ceramic material only
• CPC Class Codes: C03C 3/122 containing oxides of As, Sb, Bi, Mo, W, V, Te as glass formers
• CPC Class Codes: C03C 3/14 containing boron
• CPC Class Codes: C03C 8/04 containing zinc
• CPC Class Codes: C03C 8/14 Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
• CPC Class Codes: C03C 8/24 Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
• CPC Class Codes: C04B 2235/3215 Barium oxides or oxide-forming salts thereof
• CPC Class Codes: C04B 2235/3239 Vanadium oxides, vanadates or oxide forming salts thereof, e.g. magnesium vanadate
• CPC Class Codes: C04B 2235/3284 Zinc oxides, zincates, cadmium oxides, cadmiates, mercury oxides, mercurates or oxide forming salts thereof
• CPC Class Codes: C04B 2235/3298 Bismuth oxides, bismuthates or oxide forming salts thereof, e.g. zinc bismuthate
• CPC Class Codes: C04B 2235/3409 Boron oxide, borates, boric acids, or oxide forming salts thereof, e.g. borax
• CPC Class Codes: C04B 2235/9607 Thermal properties, e.g. thermal expansion coefficient
• CPC Class Codes: C04B 35/01 based on oxide ceramics
• CPC Class Codes: C04B 35/453 based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
• CPC Class Codes: C04B 35/495 based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
• CPC Class Codes: C04B 35/547 based on sulfides or selenides or tellurides
• CPC Class Codes: C04B 35/653 Processes involving a melting step

Abstract

Provided with a glass composition including a network-former oxide composed of any one of or both of B₂O₃ and V₂O₅ of 20-80% by weight, ZnO of 0-60% by weight and BaO of 0-80% by weight, wherein at least one of ZnO and BaO is included as an essential ingredient. The present invention is a glass material for use in sealing, which is of lead-free series, can be used for sealing at a low processing temperature and within a wide temperature range, has a low thermal expansion coefficient, superior adhesion, superior sealing processability, superior adherence, superior chemical stability, superior strength and the like and comprises sufficient practical performance to substitute for lead glass.

Claims

1. The lead-free glass material for use in sealing which has a glass composition composed of V₂O₅ of 25-75% by weight, ZnO of 0-45% by weight and BaO of 15-55% by weight.

2. A lead-free glass material for use in sealing, which has a glass composition consisting essentially of (A) 1-60 parts by weight of one or both of TeO₂ and Bi₂O₃ and (B) 100 parts by weight of said composition being an oxide consisting essentially of 25-75% by weight V₂O₅, 0-45% by weight ZnO and 15-55% by weight BaO.

3. A lead-free glass material for use in sealing consisting essentially of a refractory filler mixed with glass powder, said glass powder consisting essentially of V₂O₅ of 25-75% by weight, ZnO of 0-45% by weight and BaO of 15-55% by weight.

4. The lead-free glass material for use in sealing according to claim 3, wherein the refractory filler is at least one kind of low-expansion ceramic powder selected from cordierite, zirconyl phosphate, β

-eucryptite, β

-spodumene, zircon, alumina, mullite, silica, β

-quartz solid solution, zinc silicate and aluminum titanate, and the compounding quantity of said refractory filler is less than or equal to 150 part by weight for said glass powder of 100 part by weight.

5. A lead-free glass powder paste for use in sealing consisting essentially of V₂O₅ of 25-75% by weight, ZnO of 0-45% by weight and BaO of 15-55% by weight.

6. A lead-free glass mixed powder paste for use in sealing including a refractory filler added to a glass powder paste, said glass powder paste consisting essentially of V₂O₅ of 25-75% by weight, ZnO of 0-45% by weight and BaO of 15-55% by weight.

7. A lead-free glass powder paste for use in sealing consisting essentially of (A) 1-60 parts by weight of one or both of TeO₂ and Bi₂O₃ and (B) 100 parts by weight of said paste being an oxide consisting essentially of 25-75% by weight V₂O₅, 0-45% by weight ZnO and 15-55% by weight BaO.

8. A lead-free glass mixed powder paste for use in sealing including a refractory filler added to a glass powder paste, said glass powder paste consisting essentially of (A) 1-60 parts by weight of one or both of TeO₂ and Bi₂O₃ and (B) 100 parts by weight of said paste being an oxide consisting essentially of 25-75% by weight V₂O₅, 0-45% by weight ZnO and 15-55% by weight BaO.