Integrated circuit transformer devices for on-chip millimeter-wave applications
First Claim
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1. An integrated circuit transformer, comprising:
- a substrate having a substrate surface in a lateral plane;
a ground shield formed on the substrate surface;
a primary conductor comprising an elongated conductive strip having a longitudinal axis extending in a first direction; and
a secondary conductor comprising an elongated conductive strip having a longitudinal axis extending in the first direction;
wherein the primary conductor and the secondary conductor lie in respective different planes substantially parallel to the lateral plane and are aligned with one another and to form a coupled-wire structure that is disposed adjacent to the ground shield; and
wherein the ground shield comprises a pattern of close-ended parallel elongated slots, wherein a longitudinal axis of each of the elongated slots of the ground shield extends in a second direction that is orthogonal to the first direction, and wherein the ground shield comprises edge regions that provide current return paths that are collinear to the first direction, wherein the edge regions are disposed adjacent to ends of the close-ended parallel elongated slots.
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Abstract
Methods are provided for building integrated circuit transformer devices having compact and optimized architectures for use in MMW (millimeter-wave) applications. The integrated circuit transformer devices have universal and scalable architectures that can be used as templates or building blocks for constructing various types of on-chip devices for millimeter-wave applications.
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Citations
16 Claims
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1. An integrated circuit transformer, comprising:
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a substrate having a substrate surface in a lateral plane; a ground shield formed on the substrate surface; a primary conductor comprising an elongated conductive strip having a longitudinal axis extending in a first direction; and a secondary conductor comprising an elongated conductive strip having a longitudinal axis extending in the first direction; wherein the primary conductor and the secondary conductor lie in respective different planes substantially parallel to the lateral plane and are aligned with one another and to form a coupled-wire structure that is disposed adjacent to the ground shield; and wherein the ground shield comprises a pattern of close-ended parallel elongated slots, wherein a longitudinal axis of each of the elongated slots of the ground shield extends in a second direction that is orthogonal to the first direction, and wherein the ground shield comprises edge regions that provide current return paths that are collinear to the first direction, wherein the edge regions are disposed adjacent to ends of the close-ended parallel elongated slots. - View Dependent Claims (2, 3, 4, 5, 6, 16)
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7. A semiconductor IC (integrated circuit) chip, comprising:
an integrated circuit comprising a transformer, wherein the transformer comprises; a ground shield disposed in a lateral plane; a primary conductor comprising at least one elongated conductive strip having a longitudinal axis extending in a first direction; a secondary conductor comprising at least one elongated conductive strip having a longitudinal axis extending in the first direction; wherein the primary conductor and the secondary conductor lie in respective planes substantially parallel to the lateral plane and are aligned with one another to form a coupled-wire structure that is disposed adjacent to the ground shield; and wherein the ground shield comprises a pattern of close-ended parallel elongated slots, wherein a longitudinal axis of each of the elongated slots of the ground shield extends in a second direction that is orthogonal to the first direction, and edge regions that provide current return paths that are collinear to the first direction, wherein the edge regions are disposed adjacent to ends of the close-ended parallel elongated slots. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15)
Specification