Inspection method for semiconductor device
First Claim
1. An inspection method comprising:
- supplying a signal or power supply voltage to each of a plurality of chips without contact using an antenna of each of the plurality of chips;
moving a plurality of inspection electrodes with an arbitrary portion of the antenna or the whole antenna of each of the plurality of chips overlapped with each of the inspection electrodes with a space therebetween; and
grasping a plurality of operating states of the plurality of chips from a voltage of each of the inspection electrodes and a position of each of the inspection electrodes.
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Abstract
The present invention provides an inspection system of ID chips that can supply a signal or power supply voltage to an ID chip without contact, and can increase throughput of an inspection process and an inspection method using the inspection system. The inspection system according to the present invention includes a plurality of inspection electrodes, a plurality of inspection antennas, a position control unit, a unit for applying voltage to each of the inspection antennas, and a unit for measuring potentials of the inspection electrodes. One feature of the inspection system is that a plurality of ID chips and the plurality of inspection electrodes are overlapped with a certain space therebetween, and the plurality of ID chips and the plurality of inspection antennas are overlapped with a certain space therebetween, and the plurality of ID chips are interposed between the plurality of inspection electrodes and the plurality of inspection antennas by the position control unit.
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Citations
14 Claims
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1. An inspection method comprising:
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supplying a signal or power supply voltage to each of a plurality of chips without contact using an antenna of each of the plurality of chips; moving a plurality of inspection electrodes with an arbitrary portion of the antenna or the whole antenna of each of the plurality of chips overlapped with each of the inspection electrodes with a space therebetween; and grasping a plurality of operating states of the plurality of chips from a voltage of each of the inspection electrodes and a position of each of the inspection electrodes. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An inspection method comprising:
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overlapping each antenna of a plurality of chips with each of inspection electrodes with a space therebetween to supply a signal or power supply voltage to each of the plurality of chips without contact; moving the inspection electrodes with an arbitrary portion of the antenna or the whole antenna of each the plurality of chips overlapped with each of the inspection electrodes with a space therebetween; and grasping a plurality of operating states of the plurality of chips from a voltage of each of the inspection electrodes and a position of each of the inspection electrodes to the plurality of chips. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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Specification